SCHEMBL23175100

SCHEMBL23175100

O=C(O)c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2-c2cccc(C(F)(F)F)c2)cc1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 3/20 0.46
AKR1C2 P52895 3/20 0.46
MCL1 Q07820 1/20 0.45
CNR2 P34972 1/20 0.44
RORC P51449 2/20 0.43
RORB Q92753 2/20 0.43
ACLY P53396 1/20 0.43
RXRA P19793 1/20 0.42
RXRB P28702 1/20 0.42
FABP4 P15090 2/20 0.42
EIF4E P06730 1/20 0.42
KMO O15229 2/20 0.41
ADORA1 P30542 1/20 0.41
TRPM2 O94759 1/20 0.41
KDM4E B2RXH2 1/20 0.40
ALDH1A1 P00352 1/20 0.40
HPGD P15428 1/20 0.40
HSD17B10 Q99714 1/20 0.40
KIF11 P52732 1/20 0.40
XDH P47989 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14252238 0.84 RXRA (0.56) CNR2ACLYRXRARXRBKMO
SCHEMBL6114449 0.82 PTPN1 (0.46) AKR1C3AKR1C2MCL1ACLYFABP4
SCHEMBL3807758 0.82 ACMSD (0.45) AKR1C2MCL1ACLYKDM4EALDH1A1
SCHEMBL9813471 0.80 ACMSD (0.53) MCL1ACLYKMOHSD17B10
SCHEMBL23908704 0.79 AKR1C3 (0.47) AKR1C3AKR1C2MCL1CNR2RORC
SCHEMBL5851623 0.78 RORC (0.54) AKR1C3AKR1C2CNR2RORCRORB
SCHEMBL23175101 0.76 CYP2C8 (0.52) ACLYRXRARXRBKDM4EALDH1A1
SCHEMBL4851323 0.76 RXRB (0.43) AKR1C2MCL1RXRARXRBFABP4
SCHEMBL10783606 0.76 FOLH1 (0.54) AKR1C3AKR1C2RXRARXRBFABP4
SCHEMBL17744866 0.74 MCL1 (0.51) MCL1KDM4EALDH1A1HPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021066011-A1 RESIN COMPOSITION, FILM, COMPOSITE MATERIAL, MOVABLE BODY, AND MATERIAL FOR THREE-DIMENSIONAL SHAPING USE 三菱ケミカル株式会社 2021-04-08 WO disclosed