SCHEMBL23208416

SCHEMBL23208416

COCOCc1ccc(-c2cc(-c3ccc(COCOC)cc3)c(S(=O)(=O)O)c(-c3ccc(COCOC)cc3)c2)cc1

nearest known ligand 0.36

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
▸ ERN1 O75460 2/20 0.36
▸ GSTP1 P09211 2/20 0.35
▸ EGFR P00533 2/20 0.33
▸ PTGS2 P35354 1/20 0.33
▸ FYN P06241 1/20 0.32
▸ CA2 P00918 2/20 0.31
▸ CA9 Q16790 2/20 0.31
▸ IKBKB O14920 1/20 0.31
▸ CHUK O15111 1/20 0.31
▸ CA1 P00915 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21794137 0.80 FYN (0.49) ERN1GSTP1EGFRFYN
SCHEMBL21794163 0.77 CA2 (0.41) ERN1PTGS2FYNCA2CA9
SCHEMBL24581546 0.76 EGFR (0.47) GSTP1EGFRFYNCA2CA9
SCHEMBL21794146 0.74 SMN1; SMN2 (0.50) ERN1PTGS2CA2CA9CA1
SCHEMBL21794266 0.73 ESR1 (0.50) FYN
SCHEMBL23432948 0.71 CA1 (0.54) ERN1EGFRPTGS2CA2CA9
SCHEMBL24995338 0.69 ERN1 (0.36) ERN1
SCHEMBL21794139 0.68 MMP3 (0.52) EGFR
SCHEMBL21794265 0.68 PTPN1 (0.47) PTGS2CA2CA9IKBKBCHUK
SCHEMBL14815509 0.68 MCHR1 (0.34) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220206386-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-06-30 — — US disclosed
WO-2021065450-A1 ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2021-04-08 — — WO disclosed
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