SCHEMBL23609663

SCHEMBL23609663

C=Cc1c(F)c(F)c(F)c(C(=O)O)c1F

nearest known ligand 0.33

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 2/20 0.33
▸ PKM P14618 1/20 0.33
▸ MEN1 O00255 4/20 0.33
▸ KMT2A Q03164 4/20 0.33
▸ CRHBP P24387 1/20 0.33
▸ CRHR2 Q13324 1/20 0.33
▸ CES2 O00748 1/20 0.31
▸ CES1 P23141 1/20 0.31
▸ METAP2 P50579 1/20 0.31
▸ GAA P10253 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4825438 0.96 METAP2 (0.32) SMN1; SMN2PKMMEN1KMT2ACRHBP
SCHEMBL27790465 0.82 — —
Propene SCHEMBL27764142 0.79 MEN1 (0.39) SMN1; SMN2PKMMEN1KMT2ACRHBP
SCHEMBL203915 0.78 CES2 (0.43) SMN1; SMN2PKMMEN1KMT2ACRHBP
Ethylene SCHEMBL4584731 0.76 CES2 (0.39) SMN1; SMN2PKMMEN1KMT2ACRHBP
SCHEMBL12939148 0.76 ALDH1A1 (0.32) SMN1; SMN2PKMGAA
Ammonia Solution, Strong SCHEMBL20291864 0.75 CES2 (0.42) SMN1; SMN2PKMMEN1KMT2ACRHBP
SCHEMBL336420 0.75 CES2 (0.42) SMN1; SMN2PKMMEN1KMT2ACRHBP
SCHEMBL2150002 0.75 CES2 (0.42) SMN1; SMN2PKMMEN1KMT2ACRHBP
Formaldehyde SCHEMBL28740243 0.75 MEN1 (0.36) SMN1; SMN2PKMMEN1KMT2ACRHBP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023054126-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN-FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-04-06 — — WO disclosed
WO-2021131655-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2021-07-01 — — WO disclosed
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