SCHEMBL2367747

SCHEMBL2367747

ClC(Cl)(Cl)c1ncnc(-c2ccccc2)n1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 4/20 0.38
RAB9A P51151 4/20 0.38
MAPK1 P28482 1/20 0.38
LMNA P02545 3/20 0.38
SMN1; SMN2 Q16637 3/20 0.38
NFKB1 P19838 1/20 0.38
NFKB2 Q00653 1/20 0.38
RELA Q04206 1/20 0.38
KMT2A Q03164 3/20 0.37
MEN1 O00255 2/20 0.37
HTT P42858 1/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
POLB P06746 1/20 0.36
ADORA3 P0DMS8 1/20 0.36
ADORA2A P29274 1/20 0.36
ADORA2B P29275 1/20 0.36
ADORA1 P30542 1/20 0.36
MAPT P10636 1/20 0.36
RECQL P46063 1/20 0.36
NR1H4 Q96RI1 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27689580 0.96 NPC1 (0.39) NPC1RAB9AMAPK1LMNASMN1; SMN2
Biphenyl SCHEMBL864069 0.86 ALDH1A1 (0.39) NPC1RAB9ALMNASMN1; SMN2NFKB1
SCHEMBL10803923 0.85 KMT2A (0.41) NPC1RAB9ALMNASMN1; SMN2RELA
SCHEMBL2199254 0.83 HRH4 (0.45) NPC1RAB9ASMN1; SMN2KMT2AMEN1
SCHEMBL4413811 0.81 KDM4E (0.39) NPC1RAB9ALMNASMN1; SMN2NFKB1
SCHEMBL5574497 0.81 CYP19A1 (0.42) NPC1RAB9ASMN1; SMN2L3MBTL1MAPT
SCHEMBL24795085 0.81 L3MBTL1 (0.41) NPC1RAB9AMAPK1LMNASMN1; SMN2
SCHEMBL4900598 0.79 MEN1 (0.47) NPC1RAB9AMAPK1LMNASMN1; SMN2
SCHEMBL80527 0.79 MEN1 (0.47) NPC1RAB9AMAPK1LMNASMN1; SMN2
SCHEMBL14536813 0.79 HRH4 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0621508-B1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1996-09-25 EP claimed
US-5494777-A Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-02-27 US claimed
EP-0621508-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-10-26 EP claimed
CN-105246993-A Curable composition, method of preparing cured article, and cured article formed thereby DOW CORNING 2016-01-13 CN disclosed
CN-105209244-A Method of making an article and article made by the method DOW CORNING 2015-12-30 CN disclosed
CN-103764625-A Novel compound TOKYO OHKA KOGYO CO LTD 2014-04-30 CN disclosed
EP-2375287-B1 Radiation sensitive composition FOUNDER FINE CHEMICAL INDUSTRY CO LTD (TW) 2013-06-05 EP disclosed
EP-2366544-B1 Radiation sensitive composition FOUNDER FINE CHEMICAL INDUSTRY CO LTD (TW) 2012-07-18 EP disclosed
EP-2375287-A1 Radiation sensitive composition Founder Fine Chemical Industry Co., Ltd. (TW) 2011-10-12 EP disclosed
EP-2366544-A1 Radiation sensitive composition Founder Fine Chemical Industry Co., Ltd. (TW) 2011-09-21 EP disclosed
CN-100465211-C Active energy ray-curable organopolysiloxane resin composition, light-transmitting component, and method for manufacturing the light-transmitting component DOW CORNING TORAY CO LTD (JP) 2009-03-04 CN disclosed
CN-100465212-C Active energy ray-curable organopolysiloxane resin composition, light-transmitting component, and method for producing same DOW CORNING TORAY CO LTD (JP) 2009-03-04 CN disclosed
WO-2006014708-A9 THERMALLY SENSITIVE COATING COMPOSITIONS USEFUL FOR LITHOGRAPHIC ELEMENTS CITIPLATE INC (US) 2006-04-06 WO disclosed
WO-2006014708-A2 THERMALLY SENSITIVE COATING COMPOSITIONS USEFUL FOR LITHOGRAPHIC ELEMENTS CITIPLATE, INC. (US) 2006-02-09 WO disclosed
US-20020094483-A1 Photomask, the manufacturing method, a patterning method, and a semiconductor device manufacturing method HITACHI, LTD. 2002-07-18 US disclosed
EP-0453237-B1 Photosensitive, heat-resistant resin composition and pattern formation process FUJITSU LTD (JP) 1998-12-09 EP disclosed
EP-0466025-A2 Resist material, method for the production of the same and process of forming resist patterns using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-01-15 EP disclosed