SCHEMBL2369730

SCHEMBL2369730

C=C[Si]1(C=C)CCC(c2ccccc2)(c2ccccc2)C(C)(C)O1

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.31
OPRK1 P41145 1/20 0.31
OPRL1 P41146 1/20 0.31
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5488956 0.78 OPRM1 (0.31) OPRM1OPRK1OPRL1
SCHEMBL8018743 0.76 OPRL1 (0.33) OPRM1OPRK1OPRL1MEN1KMT2A
SCHEMBL17937891 0.74
SCHEMBL3512868 0.74
SCHEMBL23748537 0.73 OPRM1 (0.32) OPRM1OPRK1OPRL1MEN1KMT2A
SCHEMBL5367983 0.69
SCHEMBL2048189 0.66 OPRM1 (0.33) OPRM1OPRK1OPRL1MEN1KMT2A
SCHEMBL27605394 0.65 OPRM1 (0.30) OPRM1OPRK1OPRL1
SCHEMBL27898023 0.65 TET3 (0.30) KMT2A
SCHEMBL8733746 0.65 HSD11B1 (0.33) OPRM1OPRK1OPRL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024190725-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-09-19 WO disclosed
US-11993715-B2 Low compression set silicon rubber composition MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) 2024-05-28 US disclosed
US-11908595-B2 Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) 2024-02-20 US disclosed
EP-2542624-B2 USE OF A CURABLE POLYORGANOSILOXANE COMPOSITION AS AN ENCAPSULANT FOR A SOLAR CELL MODULE MOMENTIVE PERFORMANCE MAT GMBH (DE) 2024-01-10 EP disclosed
US-20230383067-A1 NON-CURABLE SILICONE COMPOSITION COMPRISING CARBON BLACK MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) 2023-11-30 US disclosed
WO-2023227714-A1 NEW SUBSTITUTED PHOSPHITE TRANSITION METAL COMPOUNDS MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) 2023-11-30 WO disclosed
EP-4233078-A1 NON-CURABLE SILICONE COMPOSITION COMPRISING CARBON BLACK Momentive Performance Materials GmbH (DE) 2023-08-30 EP disclosed
EP-2879808-B1 PROCESS FOR THE MANUFACTURE OF A MULTILAYER SILICONE STRUCTURE MOMENTIVE PERFORMANCE MAT GMBH (DE) 2023-07-26 EP disclosed
EP-3850049-B1 FUNCTIONAL POLYSILOXANES MOMENTIVE PERFORMANCE MAT GMBH (DE) 2023-03-08 EP disclosed
CN-112218914-B Oil-permeable self-bonding liquid organic silicone rubber composition 莫门蒂夫性能材料股份有限公司 2022-11-22 CN disclosed
EP-1699897-A2 CURABLE SILOXANE COMPOSITION WITH MODIFIED SURFACE PROPERTIES GE Bayer Silicones GmbH & Co. KG (DE) 2006-09-13 EP disclosed
WO-2005063890-A2 CURABLE SILOXANE COMPOSITION WITH MODIFIED SURFACE PROPERTIES GE BAYER SILICONES GMBH & CO. KG (DE) 2005-07-14 WO disclosed
WO-2005054394-A2 CURABLE SILICONE PRESSURE ADHESIVE COATING COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2005-06-16 WO disclosed
US-20050113513-A1 Curable silicone pressure adhesive coating compositions GENERAL ELECTRIC COMPANY 2005-05-26 US disclosed
US-5602214-A CONTAINING POLYSILOXANE, SILICONE GUM AND SILICONE FLUID; HIGH TACK, QUICK STICK, PEEL STRENGTH GENERAL ELECTRIC COMPANY (US) 1997-02-11 US disclosed
US-5580915-A CURABLE BLEND OF SOLID SILICON COPOLYMERS, SILICONE GUMS AND FLUIDS, FOR PRESSURE SENSITIVE ADHESIVES HAVING RESIDUE-FREE REMOVAL GENERAL ELECTRIC COMPANY (US) 1996-12-03 US disclosed
US-5576110-A PRESSURE SENSITIVE ADHESIVES GENERAL ELECTRIC COMPANY (US) 1996-11-19 US disclosed
EP-0506370-B1 Silicone pressure sensitive adhesive compositions having high solids content GEN ELECTRIC (US) 1995-11-15 EP disclosed
US-5190827-A Curable polysiloxanes on supports for adhesive tapes GENERAL ELECTRIC COMPANY (US) 1993-03-02 US disclosed
EP-0506370-A2 Silicone pressure sensitive adhesive compositions having high solids content GENERAL ELECTRIC COMPANY (US) 1992-09-30 EP disclosed