SCHEMBL23722666

SCHEMBL23722666

C=CCOC1C=Cc2ccccc21

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.36
RET P07949 1/20 0.36
HTR2A P28223 2/20 0.35
HTR6 P50406 1/20 0.35
ALDH1A1 P00352 1/20 0.34
KDM4E B2RXH2 2/20 0.33
CYP2D6 P10635 2/20 0.33
LMNA P02545 1/20 0.33
TP53 P04637 1/20 0.33
CHRM2 P08172 1/20 0.33
CHRM1 P11229 1/20 0.33
DRD2 P14416 1/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33
NFKB1 P19838 1/20 0.33
CHRM3 P20309 1/20 0.33
SLC6A2 P23975 1/20 0.33
HTR2C P28335 1/20 0.33
ADRA1A P35348 1/20 0.33
HRH1 P35367 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5718862 0.80 RET (0.39) CYP3A4RETHTR2AHTR6KDM4E
SCHEMBL14074069 0.78 CYP3A4 (0.39) CYP3A4RETHTR2AHTR6ALDH1A1
SCHEMBL13998267 0.78 CYP3A4 (0.39) CYP3A4RETHTR2AHTR6ALDH1A1
SCHEMBL4516491 0.77 RET (0.42) CYP3A4RETHTR2AHTR6KDM4E
SCHEMBL29434193 0.74 RET (0.44) CYP3A4RETHTR2AHTR6ALDH1A1
SCHEMBL1680358 0.74 HTR2A (0.38) CYP3A4RETHTR2AHTR6KDM4E
SCHEMBL8959338 0.73 HTR6 (0.31) HTR2AHTR6
SCHEMBL4506450 0.71 EYA2 (0.43) CYP3A4RETHTR2AHTR6ALDH1A1
SCHEMBL29815940 0.71 EYA2 (0.43) CYP3A4RETHTR2AHTR6ALDH1A1
SCHEMBL29672995 0.71 PTGDR2 (0.41) RETHTR2AHTR6ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-20220220272-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-07-14 US disclosed
US-11242425-B2 Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-02-08 US disclosed
US-20210246251-A1 RESIN COMPOSITION, PREPREG, RESIN-ADDED FILM, RESIN-ADDED METAL FOIL, METAL-CLAD LAYERED PLATE, AND WIRING PLATE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2021-08-12 US disclosed