SCHEMBL23854026

SCHEMBL23854026

O=C(O)c1cc(O)ncc1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA1 P00915 4/20 0.45
▸ CA2 P00918 4/20 0.45
▸ CA12 O43570 3/20 0.45
▸ CA7 P43166 3/20 0.45
▸ CA9 Q16790 3/20 0.45
▸ CA14 Q9ULX7 3/20 0.45
▸ PTGS2 P35354 2/20 0.45
▸ ALOX5 P09917 1/20 0.45
▸ ALDH1A1 P00352 4/20 0.42
▸ KDM4E B2RXH2 4/20 0.42
▸ MEN1 O00255 2/20 0.42
▸ KDR P35968 2/20 0.42
▸ KMT2A Q03164 2/20 0.42
▸ HPGD P15428 2/20 0.42
▸ CYP3A4 P08684 2/20 0.42
▸ TNF P01375 1/20 0.42
▸ HSPD1 P10809 1/20 0.42
▸ THRB P10828 1/20 0.42
▸ CYP2C9 P11712 1/20 0.42
▸ ALOX15 P16050 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL915144 0.82 ALDH1A1 (0.45) CA1CA2CA12CA7CA9
SCHEMBL13360236 0.82 CA1 (0.45) CA1CA2CA12CA7CA9
SCHEMBL9318569 0.80 KDM4E (0.62) CA1CA2CA12CA7CA9
SCHEMBL20855918 0.78 CA1 (0.48) CA1CA2CA12CA7CA9
SCHEMBL5357531 0.78 GABRP (0.58) CA1CA2CA12CA7CA9
SCHEMBL7018427 0.78 CSNK2A1 (0.48) CA1CA2CA12CA7CA9
SCHEMBL3427266 0.78 KDM4E (0.47) PTGS2ALDH1A1KDM4EMEN1KDR
SCHEMBL21246826 0.78 CA1 (0.42) CA1CA2CA12CA7CA9
SCHEMBL21826652 0.78 AKR1C4 (0.44) CA1CA2CA12CA7CA9
SCHEMBL13328091 0.77 CA1 (0.41) CA1CA2CA12CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12077680-B2 Polishing composition, production method of the same, polishing method and a manufacturing method of a semiconductor substrate FUJIMI INCORPORATED (JP) 2024-09-03 — — US claimed
US-20210301174-A1 POLISHING COMPOSITION, PRODUCTION METHOD OF THE SAME, POLISHING METHOD AND A MANUFACTURING METHOD OF A SEMICONDUCTOR SUBSTRATE FUJIMI INCORPORATED (JP) 2021-09-30 — — US claimed
US-12077680-B2 Polishing composition, production method of the same, polishing method and a manufacturing method of a semiconductor substrate FUJIMI INCORPORATED (JP) 2024-09-03 — — US disclosed
US-20210301174-A1 POLISHING COMPOSITION, PRODUCTION METHOD OF THE SAME, POLISHING METHOD AND A MANUFACTURING METHOD OF A SEMICONDUCTOR SUBSTRATE FUJIMI INCORPORATED (JP) 2021-09-30 — — US disclosed
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