SCHEMBL2385696

SCHEMBL2385696

Cc1cc(Cc2ccc(O)cc2)c(O)c(Cc2cc(Cc3cc(C)cc(Cc4ccc(O)cc4)c3O)c(O)c(C3CCCCC3)c2)c1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NUDT1 P36639 1/20 0.39
BACE1 P56817 1/20 0.39
AMY1A P0DUB6 1/20 0.39
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HIF1A Q16665 1/20 0.35
IDH1 O75874 2/20 0.34
ESR1 P03372 3/20 0.33
ESR2 Q92731 2/20 0.33
PSMB5 P28074 1/20 0.33
HSPA5 P11021 1/20 0.33
PTGDR2 Q9Y5Y4 1/20 0.33
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33
KEAP1 Q14145 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
MAPT P10636 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8141767 0.91 NUDT1 (0.40) NUDT1BACE1ESR1ESR2HSPA5
SCHEMBL4061548 0.90 NUDT1 (0.44) NUDT1BACE1CYP2C9ESR1ESR2
SCHEMBL8150872 0.88 NUDT1 (0.34) NUDT1BACE1AMY1ACYP2C9CYP2C19
SCHEMBL8142256 0.88 NUDT1 (0.40) NUDT1BACE1ESR1ESR2NPC1
SCHEMBL27946352 0.88 AMY1A (0.38) NUDT1BACE1AMY1ACYP2C9CYP2C19
SCHEMBL8142469 0.88 NUDT1 (0.39) NUDT1BACE1ESR1ESR2HSPA5
SCHEMBL2386130 0.88 SHBG (0.43) NUDT1BACE1CYP2C9CYP2C19ESR1
SCHEMBL27946351 0.88 NUDT1 (0.51) NUDT1BACE1AMY1ACYP2C9CYP2C19
SCHEMBL9445214 0.87 NUDT1 (0.43) NUDT1BACE1AMY1ASMN1; SMN2PSMB5
SCHEMBL8150433 0.87 OPRM1 (0.38) NUDT1BACE1AMY1ACYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 123 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
US-6905809-B2 Photoresist compositions CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-14 US claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
CN-118295211-A Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board 深圳市容大感光科技股份有限公司 2024-07-05 CN disclosed
CN-117939914-A Structure, display element, pattern for partition wall, and method for forming the same 东京应化工业株式会社 2024-04-26 CN disclosed
US-6177226-B1 PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2001-01-23 US disclosed
US-6127087-A COMPOSITION COMPRISING ALKALI-SOLUBLE RESIN, SPECIFIED QUINONEDIAZIDE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2000-10-03 US disclosed
US-6120969-A PHENOLIC RESINS FOR PHOTORESISTS TOKYO OHKA KOGYO CO., LTD. (JP) 2000-09-19 US disclosed
US-6106994-A ESTERIFYING A POLYPHENOL COMPOUND AND NAPHTHOQUINONE-1,2-DIAZIDESULFONYL HALIDE IN THE PRESENCE OF FOR EXAMPLE MONOMETHYLDICYCLOHEXYLAMINE, AND POSITIVE PHOTOSENSITIVE COMPOSITION CONTAINS RESULTANT ESTER TOKYO OHKA KOGYO CO., LTD. (JP) 2000-08-22 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed