SCHEMBL23909540

SCHEMBL23909540

N#Cc1cccc2ccc(S(=O)(=O)Cl)cc12

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 4/20 0.45
CA2 P00918 4/20 0.45
HTT P42858 2/20 0.39
PTGES O14684 2/20 0.37
ALDH1A1 P00352 3/20 0.37
KDM4E B2RXH2 1/20 0.37
HSP90AA1 P07900 1/20 0.36
HSP90AB1 P08238 1/20 0.36
SLC22A12 Q96S37 2/20 0.35
MCL1 Q07820 1/20 0.35
HSD17B10 Q99714 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
MAPT P10636 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
KAT6A Q92794 1/20 0.33
SLC40A1 Q9NP59 1/20 0.33
ANPEP P15144 1/20 0.33
NQO2 P16083 1/20 0.33
MTNR1A P48039 1/20 0.33
MTNR1B P49286 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909520 0.87 HTT (0.42) CA1CA2HTTPTGESALDH1A1
SCHEMBL14059011 0.84 LMNA (0.51) CA1CA2ALDH1A1MAPTNQO2
SCHEMBL6181850 0.76 CYP1A2 (0.47) ALDH1A1HSD17B10TDP1KAT6ANQO2
SCHEMBL11136985 0.76 HTR6 (0.41) CA1CA2ALDH1A1HSD17B10TDP1
SCHEMBL31387942 0.76 CYP1A2 (0.47) ALDH1A1HSD17B10TDP1KAT6ANQO2
SCHEMBL1941288 0.73 EPAS1 (0.41) ALDH1A1SLC22A12HSD17B10TDP1
SCHEMBL18322219 0.72 HTT (0.53) CA1CA2HTTALDH1A1KDM4E
SCHEMBL819093 0.72 CA1 (0.55) CA1CA2HTTALDH1A1KDM4E
SCHEMBL29489120 0.72 CA1 (0.55) CA1CA2HTTALDH1A1KDM4E
SCHEMBL23909547 0.71 LMNA (0.51) CA1CA2HTTALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed