SCHEMBL23909595

SCHEMBL23909595

Cc1ccc2c(C(N)=O)cccc2c1C(=O)O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.42
ATM Q13315 1/20 0.42
ALDH1A1 P00352 3/20 0.41
KDM4E B2RXH2 3/20 0.41
MYC P01106 1/20 0.41
GAA P10253 1/20 0.41
HSD17B10 Q99714 2/20 0.41
HPGD P15428 1/20 0.41
L3MBTL1 Q9Y468 2/20 0.39
CYP3A4 P08684 2/20 0.39
TDP1 Q9NUW8 1/20 0.39
CYP2C9 P11712 1/20 0.39
PARP1 P09874 2/20 0.38
PRNP P04156 1/20 0.38
MCL1 Q07820 1/20 0.38
NR4A1 P22736 1/20 0.38
NR4A2 P43354 1/20 0.38
NR4A3 Q92570 1/20 0.38
CDC25B P30305 1/20 0.38
ALOX15 P16050 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9558286 0.88 NR4A1 (0.50) KMT2AALDH1A1KDM4EMYCHSD17B10
SCHEMBL23909534 0.83 ALDH1A1 (0.41) KMT2AALDH1A1KDM4EMYCHSD17B10
SCHEMBL1048314 0.80 CYP1A2 (0.52) KMT2AALDH1A1KDM4EMYCHSD17B10
SCHEMBL6029391 0.80 ALDH1A1 (0.52) KMT2AALDH1A1KDM4EMYCHSD17B10
SCHEMBL10015553 0.80 LDHA (0.47) ALDH1A1L3MBTL1CYP3A4TDP1CYP2C9
SCHEMBL3819511 0.79 TDP1 (0.46) KMT2AALDH1A1KDM4EHSD17B10HPGD
SCHEMBL11607263 0.78 CYP1A2 (0.54) KMT2AATMALDH1A1KDM4EMYC
SCHEMBL23909581 0.78 KMT2A (0.47) KMT2AATMALDH1A1KDM4EMYC
SCHEMBL7916759 0.78 NR4A1 (0.59) KMT2AATMALDH1A1KDM4EGAA
SCHEMBL6135290 0.78 ATM (0.61) KMT2AATMALDH1A1KDM4EGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed