Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 15/20 | 0.64 |
| ▸ | CA5A | P35218 | 3/20 | 0.64 |
| ▸ | CA1 | P00915 | 13/20 | 0.63 |
| ▸ | CA9 | Q16790 | 12/20 | 0.63 |
| ▸ | CA12 | O43570 | 10/20 | 0.63 |
| ▸ | CA14 | Q9ULX7 | 5/20 | 0.63 |
| ▸ | CA13 | Q8N1Q1 | 3/20 | 0.63 |
| ▸ | CA3 | P07451 | 1/20 | 0.63 |
| ▸ | CA4 | P22748 | 1/20 | 0.63 |
| ▸ | CA6 | P23280 | 1/20 | 0.63 |
| ▸ | CA7 | P43166 | 1/20 | 0.63 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.63 |
| ▸ | LMNA | P02545 | 1/20 | 0.56 |
| ▸ | VCAM1 | P19320 | 1/20 | 0.49 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23909541 | 0.95 | CA2 (0.66) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL3829978 | 0.82 | TSHR (0.56) | LMNAMAPT | |
| SCHEMBL23909603 | 0.82 | GAA (0.44) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL11517174 | 0.82 | ALDH1A1 (0.45) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL243443 | 0.78 | CA2 (1.00) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL31527763 | 0.78 | CA2 (1.00) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL189037 | 0.78 | CA2 (1.00) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL31527772 | 0.78 | CA2 (1.00) | CA2CA5ACA1CA9CA12 | |
| SCHEMBL6400928 | 0.78 | CA2 (1.00) | CA2CA5ACA1CA9CA12 | |
| Iodide SCHEMBL28544135 | 0.77 | CA2 (0.95) | CA2CA5ACA1CA9CA12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| EP-3896521-B1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2022-12-14 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| CN-113527680-A | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896521-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |