SCHEMBL23909583

SCHEMBL23909583

Cc1ccc2cc(S(=O)(=O)Cl)ccc2c1C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
CYP1A2 P05177 4/20 0.39
CYP2C19 P33261 4/20 0.39
HSD17B10 Q99714 3/20 0.39
KDM4E B2RXH2 1/20 0.39
MEN1 O00255 1/20 0.39
GLA P06280 1/20 0.39
HPGD P15428 1/20 0.39
KMT2A Q03164 1/20 0.39
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
METAP2 P50579 3/20 0.35
METAP1 P53582 1/20 0.35
CYP3A4 P08684 2/20 0.34
STAT6 P42226 1/20 0.34
HIF1A Q16665 1/20 0.34
CASP6 P55212 2/20 0.34
CYP2C9 P11712 4/20 0.33
AKR1C3 P42330 2/20 0.33
AKR1C2 P52895 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909517 0.89 ALDH1A1 (0.37) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL20130411 0.83 CYP1A2 (0.40) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL23909551 0.79 LMNA (0.40) ALDH1A1HSD17B10KDM4EMEN1HPGD
SCHEMBL931068 0.77 ALDH1A1 (0.52) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL11591905 0.76 PTPN1 (0.50) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL2750024 0.76 KDM4E (0.44) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL23909524 0.75 ALDH1A1 (0.41) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL4751251 0.74 ALDH1A1 (0.48) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
Ethylene SCHEMBL28494344 0.74 ALDH1A1 (0.49) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E
SCHEMBL2747254 0.74 ALDH1A1 (0.43) ALDH1A1CYP1A2CYP2C19HSD17B10KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed