SCHEMBL23909517

SCHEMBL23909517

Cc1ccc2ccc(S(=O)(=O)Cl)cc2c1C(=O)O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.37
MAPK1 P28482 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
METAP2 P50579 3/20 0.36
METAP1 P53582 1/20 0.35
TDP1 Q9NUW8 3/20 0.34
LMNA P02545 2/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
HSD17B10 Q99714 2/20 0.33
AGTR1 P30556 1/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
PKM P14618 1/20 0.33
GAA P10253 1/20 0.33
GFER P55789 1/20 0.33
HTT P42858 1/20 0.33
LDHA P00338 1/20 0.33
LDHB P07195 1/20 0.33
KDM4E B2RXH2 1/20 0.33
CYP1A2 P05177 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909583 0.89 ALDH1A1 (0.39) ALDH1A1MAPK1SMN1; SMN2METAP2METAP1
SCHEMBL23909558 0.78 LMNA (0.41) ALDH1A1SMN1; SMN2METAP2LMNAHSD17B10
SCHEMBL7144236 0.76 LDHA (0.50) ALDH1A1MAPK1SMN1; SMN2LMNAL3MBTL1
SCHEMBL35163 0.75 KDM4E (0.51) ALDH1A1METAP2LMNAL3MBTL1HSD17B10
SCHEMBL23909573 0.74 ALDH1A1 (0.39) ALDH1A1MAPK1SMN1; SMN2TDP1HSD17B10
SCHEMBL20669903 0.73 DHODH (0.47) ALDH1A1
SCHEMBL20130411 0.72 CYP1A2 (0.40) ALDH1A1METAP2METAP1HSD17B10MEN1
SCHEMBL1279551 0.71 LMNA (0.46) ALDH1A1METAP2LMNAL3MBTL1HSD17B10
SCHEMBL23909600 0.71 LCK (0.43) ALDH1A1SMN1; SMN2TDP1HSD17B10KMT2A
SCHEMBL23909551 0.71 LMNA (0.40) ALDH1A1METAP2LMNAHSD17B10MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed