SCHEMBL23909551

SCHEMBL23909551

Cc1c(C(=O)O)ccc2cc(S(=O)(=O)Cl)ccc12

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.40
ACLY P53396 2/20 0.36
METAP2 P50579 1/20 0.35
PTGDR2 Q9Y5Y4 1/20 0.35
PPARA Q07869 1/20 0.35
ALDH1A1 P00352 2/20 0.34
PTPN1 P18031 1/20 0.34
KDM4E B2RXH2 1/20 0.34
HPGD P15428 1/20 0.34
HSD17B10 Q99714 1/20 0.34
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
LCK P06239 1/20 0.34
CASP6 P55212 1/20 0.34
MPL P40238 1/20 0.34
PTGER4 P35408 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909558 0.89 LMNA (0.41) LMNAACLYMETAP2ALDH1A1KDM4E
SCHEMBL23909583 0.79 ALDH1A1 (0.39) LMNAMETAP2PTGDR2ALDH1A1KDM4E
SCHEMBL1279551 0.77 LMNA (0.46) LMNAACLYMETAP2ALDH1A1KDM4E
SCHEMBL4137339 0.76 CA12 (0.50) ALDH1A1PTPN1HSD17B10MEN1KMT2A
SCHEMBL2749203 0.76 PTPN1 (0.59) ALDH1A1PTPN1KDM4EHPGDMEN1
SCHEMBL23909563 0.75 PTPN1 (0.46) PPARAALDH1A1PTPN1KDM4EHPGD
SCHEMBL11582938 0.75 L3MBTL1 (0.50) LMNAALDH1A1KDM4EHPGDHSD17B10
SCHEMBL2354671 0.74 RXFP1 (0.51) ALDH1A1KDM4EHPGDMEN1KMT2A
SCHEMBL20130411 0.74 CYP1A2 (0.40) METAP2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL35163 0.74 KDM4E (0.51) LMNAACLYMETAP2ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed