SCHEMBL23909597

SCHEMBL23909597

COC(=O)c1cccc2c(C(N)=O)cccc12

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.53
CFTR P13569 1/20 0.53
HSD17B10 Q99714 1/20 0.53
LMNA P02545 2/20 0.50
TSHR P16473 1/20 0.50
SIRT2 Q8IXJ6 1/20 0.47
BRD4 O60885 2/20 0.47
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
CA9 Q16790 2/20 0.47
CA5A P35218 1/20 0.47
KDM4E B2RXH2 4/20 0.47
ATM Q13315 2/20 0.47
KMT2A Q03164 1/20 0.47
POLB P06746 1/20 0.47
PSMD14 O00487 1/20 0.46
NR4A2 P43354 4/20 0.46
CREBBP Q92793 1/20 0.46
GAA P10253 1/20 0.46
CA12 O43570 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5749605 0.92 ATM (0.56) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL70429 0.90 LMNA (0.59) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL6135290 0.83 ATM (0.61) ALDH1A1HSD17B10TSHRKDM4EATM
SCHEMBL10391328 0.83 NR4A2 (0.49) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL8416022 0.83 ALDH1A1 (0.67) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL3230050 0.82 NR4A2 (0.53) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL3382516 0.82 ALDH1A1 (0.64) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL70381 0.81 BRD4 (0.59) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL29434198 0.81 BRD4 (0.59) ALDH1A1CFTRHSD17B10LMNATSHR
SCHEMBL3207564 0.81 NR4A2 (0.58) ALDH1A1CFTRHSD17B10LMNATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed