Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 1/20 | 0.48 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 1/20 | 0.48 |
| ▸ | CA4 | P22748 | 1/20 | 0.48 |
| ▸ | CA6 | P23280 | 1/20 | 0.48 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.43 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | IDH1 | O75874 | 1/20 | 0.41 |
| ▸ | BACE1 | P56817 | 1/20 | 0.41 |
| ▸ | KLKB1 | P03952 | 1/20 | 0.40 |
| ▸ | CTSB | P07858 | 1/20 | 0.40 |
| ▸ | MMP9 | P14780 | 1/20 | 0.40 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.40 |
| ▸ | DNMT3B | Q9UBC3 | 1/20 | 0.40 |
| ▸ | DNMT3L | Q9UJW3 | 1/20 | 0.40 |
| ▸ | DNMT3A | Q9Y6K1 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 2/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5882791 | 0.87 | TRPA1 (0.53) | ESR1ESR2GABRA1GABRB2MAPT | |
| SCHEMBL28390526 | 0.84 | CNR1 (0.55) | GABRA1GABRB2BACE1KDM4ERAB9A | |
| SCHEMBL9446145 | 0.80 | EGFR (0.44) | ALOX15 | |
| SCHEMBL1257364 | 0.80 | GABRA1 (0.52) | ESR1ESR2GABRA1GABRB2MAPT | |
| SCHEMBL30523630 | 0.79 | ALDH1A1 (0.59) | MAPTGAAKDM4ERAB9APKM | |
| SCHEMBL7046438 | 0.79 | ALDH1A1 (0.59) | MAPTGAAKDM4ERAB9APKM | |
| SCHEMBL12035986 | 0.78 | AMY1A (0.53) | MAPTGAAKMT2AMEN1PKM | |
| SCHEMBL31028402 | 0.78 | AMY1A (0.53) | MAPTGAAKMT2AMEN1PKM | |
| SCHEMBL14230974 | 0.77 | TSHR (0.45) | CA1CA2MAPTKMT2AKDM4E | |
| SCHEMBL19104720 | 0.77 | GABRA1 (0.48) | ESR1ESR2GABRA1GABRB2MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4100140-A | REACTING POLYMALEIMIDES WITH ALKENYLPHENOLS OR ALKENYLPHENOL ETHERS, POLYMERIZATION CATALYSTS | CIBA-GEIGY CORPORATION (US) | 1978-07-11 | — | — | US | claimed |
| US-9512333-B2 | Phosphoric acid resistant polymaleimide prepolymer compositions | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2016-12-06 | — | — | US | disclosed |
| EP-2417168-B1 | PHOSPHORIC ACID RESISTANT POLYMALEIMIDE PREPOLYMER COMPOSITIONS | HUNTSMAN ADV MAT AMERICAS INC (US) | 2014-11-26 | — | — | EP | disclosed |
| EP-2710045-A1 | HALOGEN FREE THERMOSET RESIN SYSTEM FOR LOW DIELECTRIC LOSS AT HIGH FREQUENCY APPLICATIONS | Huntsman Advanced Materials Americas LLC (US) | 2014-03-26 | — | — | EP | disclosed |
| US-20140057086-A1 | Halogen Free Thermoset Resin System for Low Dielectric Loss at High Frequency Applications | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2014-02-27 | — | — | US | disclosed |
| US-20130231021-A1 | Phosphoric Acid Resistant Polymaleimide Prepolymer Compositions | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2013-09-05 | — | — | US | disclosed |
| US-8445699-B2 | Phosphoric acid resistant polymaleimide prepolymer compositions | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2013-05-21 | — | — | US | disclosed |
| WO-2012158415-A1 | HALOGEN FREE THERMOSET RESIN SYSTEM FOR LOW DIELECTRIC LOSS AT HIGH FREQUENCY APPLICATIONS | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2012-11-22 | — | — | WO | disclosed |
| US-20120003892-A1 | Phosphoric Acid Resistant Polymaleimide Prepolymer Compositions | Huntsman Advanced Materials Americans LLC (US) | 2012-01-05 | — | — | US | disclosed |
| US-8043534-B2 | An adhesive comprising a maleimide and an aromatic diene or an aromatic monoene which cure to form useful thermosetting resins for the microelectronic packaging industry; semiconcuctor dies; addition polymerization/Diels-Alder reaction; heat and acid resistance; toughness; noncracking; nondestructive | DESIGNER MOLECULES, INC. (US) | 2011-10-25 | — | — | US | disclosed |
| US-5138000-A | High strength molding material | CIBA-GEIGY CORPORATION (US) | 1992-08-11 | — | — | US | disclosed |
| EP-0458240-A1 | Curable compositions | CIBA-GEIGY AG (CH) | 1991-11-27 | — | — | EP | disclosed |
| EP-0457732-A1 | Curable compositions | CIBA-GEIGY AG (CH) | 1991-11-21 | — | — | EP | disclosed |
| EP-0348345-A2 | Solution stable polyimide resin systems | CIBA-GEIGY AG (CH) | 1989-12-27 | — | — | EP | disclosed |
| EP-0227598-B1 | STABLE COMPOSITIONS CONTAINING IMIDES | CIBA-GEIGY AG (CH) | 1989-08-02 | — | — | EP | disclosed |
| US-4749767-A | IMPREGNATED YARN LAMINATE | CIBA-GEIGY CORPORATION (US) | 1988-06-07 | — | — | US | disclosed |
| EP-0235084-A2 | Hot-curable compositions containing substituted bicyclo[2,2,1]hept-5-ene-2,3 imides of dicarboxylic acids and polymalein imide | CIBA-GEIGY AG (CH) | 1987-09-02 | — | — | EP | disclosed |
| US-4689378-A | Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol | CIBA-GEIGY CORPORATION (US) | 1987-08-25 | — | — | US | disclosed |
| US-4678849-A | PREPREGS, COMPOSITES, COATINGS | CIBA-GEIGY CORPORATION (US) | 1987-07-07 | — | — | US | disclosed |
| EP-0227598-A1 | Stable compositions containing imides | CIBA-GEIGY AG (CH) | 1987-07-01 | — | — | EP | disclosed |