SCHEMBL241247

SCHEMBL241247

c1ccc2c(c1)nnn2NC1CCCCC1

nearest known ligand 0.49

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CCNE1 P24864 1/20 0.49
CDK2 P24941 1/20 0.49
MAPK8 P45983 1/20 0.49
MAPK9 P45984 1/20 0.49
GAA P10253 1/20 0.46
CYP4Z1 Q86W10 5/20 0.44
ALDH1A1 P00352 3/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
TOP2A P11388 1/20 0.43
KMT2A Q03164 3/20 0.43
LMNA P02545 1/20 0.43
USP2 O75604 1/20 0.42
POLB P06746 1/20 0.41
ALOX15 P16050 1/20 0.41
MEN1 O00255 1/20 0.41
TSHR P16473 1/20 0.41
MAPK1 P28482 1/20 0.41
RAB9A P51151 1/20 0.41
LCK P06239 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1560545 0.74 GAA (0.55) CCNE1CDK2MAPK8MAPK9GAA
SCHEMBL425447 0.73 KMT2A (0.55) GAAALDH1A1SMN1; SMN2KMT2AUSP2
SCHEMBL1560158 0.72 SLC9A1 (0.54) CCNE1CDK2MAPK8MAPK9GAA
SCHEMBL16372562 0.71 USP2 (0.66) GAAALDH1A1KMT2ALMNAUSP2
SCHEMBL29152989 0.71 USP2 (0.66) GAAALDH1A1KMT2ALMNAUSP2
SCHEMBL14336210 0.71 CYP4Z1 (0.44) CYP4Z1ALDH1A1POLBMAPK1
SCHEMBL5662069 0.70 CYP4Z1 (0.57) CYP4Z1ALDH1A1POLBMAPK1
SCHEMBL16639135 0.70 CYP4Z1 (0.55) CYP4Z1ALDH1A1POLBMAPK1
SCHEMBL18833167 0.70 CYP4Z1 (0.53) CYP4Z1ALDH1A1POLBMAPK1RAB9A
SCHEMBL7243835 0.70 POLB (0.55) GAACYP4Z1ALDH1A1KMT2APOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100543124-C Substrate is with clean-out system and purging method WAKO PURE CHEM IND LTD (JP) 2009-09-23 CN claimed
JP-55149393-A None JP disclosed
JP-6085455-A None JP disclosed
US-20230203347-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-06-29 US disclosed
EP-4130182-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-02-08 EP disclosed
CN-115397936-A Method for producing adhesive sheet and adhesive sheet 日东电工株式会社 2022-11-25 CN disclosed
CN-110823800-A Analysis method of methanol fuel metal corrosion inhibitor 运城学院 2020-02-21 CN disclosed
EP-1679361-B1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEM IND LTD (JP) 2015-06-24 EP disclosed
US-8900371-B2 Cleaning agent for substrate and cleaning method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2014-12-02 US disclosed
US-20120000485-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-01-05 US disclosed
CN-100543124-C Substrate is with clean-out system and purging method WAKO PURE CHEM IND LTD (JP) 2009-09-23 CN disclosed
US-20070235061-A1 Cleaning Agent for Substrate and Cleaning Method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US disclosed
CN-1875090-A Cleaning agent for substrate and cleaning method WAKO PURE CHEM IND LTD (JP) 2006-12-06 CN disclosed
EP-1679361-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD Wako Pure Chemical Industries, Ltd. (JP) 2006-07-12 EP disclosed
JP-H0685455-A SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT USE NIKKO GUURUDO FOIL KK 1994-03-25 JP disclosed
JP-S55149393-A LUBRICATING AND RUST-PROOFING AGENT FOR COPPER OR COPPER ALLOY TATSUTA ELECTRIC WIRE & CABLE CO LTD 1980-11-20 JP disclosed