SCHEMBL2495650

SCHEMBL2495650

C=Cc1ccc(OC(=O)OC(C)(C)Cc2ccc(C=CO)cc2)cc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 1/20 0.37
EPAS1 Q99814 1/20 0.37
ELANE P08246 2/20 0.37
THRB P10828 3/20 0.35
CYP3A4 P08684 3/20 0.34
CYP1A2 P05177 1/20 0.34
CYP2D6 P10635 1/20 0.34
CYP2C9 P11712 1/20 0.34
NFKB1 P19838 1/20 0.34
CYP2C19 P33261 1/20 0.34
CYP24A1 Q07973 1/20 0.34
CTSK P43235 1/20 0.34
PPARG P37231 3/20 0.34
PPARA Q07869 3/20 0.34
LMNA P02545 2/20 0.34
PMP22 Q01453 1/20 0.34
NLRP3 Q96P20 1/20 0.34
THRA P10827 1/20 0.33
HDAC3 O15379 1/20 0.33
HDAC1 Q13547 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6674723 0.92 THRB (0.38) HIF1AEPAS1ELANETHRBCYP3A4
SCHEMBL5927563 0.82 THRA (0.40) THRBCYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL6551673 0.82 PPARG (0.35) ELANECYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL6552052 0.81 CYP3A4 (0.35) ELANECYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL6864307 0.81 CTSK (0.35) HIF1AEPAS1ELANETHRBCYP3A4
SCHEMBL5454889 0.80 CTSK (0.36) ELANECYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL7728391 0.79 PPARA (0.37) HIF1AEPAS1THRBCTSKPPARG
SCHEMBL6271933 0.79 ELANE (0.44) HIF1AEPAS1ELANETHRBCYP3A4
SCHEMBL3838403 0.79 CYP3A4 (0.33) ELANECYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL4968047 0.78 CTSK (0.33) ELANECYP3A4CYP1A2CYP2D6CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2370859-A2 A PHOTOSENSITIVE COMPOSITION AZ Electronic Materials USA Corp. (US) 2011-10-05 EP disclosed
WO-2010064135-A2 A PHOTOSENSITIVE COMPOSITION AZ ELECTRONIC MATERIALS USA CORP. (US) 2010-06-10 WO disclosed
US-20100136477-A1 Photosensitive Composition AZ ELECTRONIC MATERIALS USA CORP. 2010-06-03 US disclosed
EP-2111567-A2 PHOTORESIST COMPOSITION AZ Electronic Materials USA Corp. (US) 2009-10-28 EP disclosed
WO-2008096263-A2 PHOTORESIST COMPOSITION AZ ELECTRONIC MATERIALS USA CORP. (DE) 2008-08-14 WO disclosed
US-20080187868-A1 Photoactive Compounds AZ ELECTRONIC MATERIALS USA CORP. 2008-08-07 US disclosed
US-20010049071-A1 HIGHLY SENSITIVE POSITIVE PHOTORESIST COMPOSITIONS DAVID PAUL MERRITT 2001-12-06 US disclosed
EP-0366590-B2 Highly sensitive positive photoresist compositions IBM (US) 2001-03-21 EP disclosed
US-6156476-A Positive photoresist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-12-05 US disclosed
EP-0607899-B1 Positive photoresist composition SUMITOMO CHEMICAL CO (JP) 2000-06-14 EP disclosed
US-6051659-A DISSOLVING A POLYMER HAVING ACID LABILE GROUPS PENDENT TO THE POLYMER BACKBONE IN AN ACID STABLE SOLVENT, HEATING WITH STIRRING, ADDING CONCENTRATED MINERAL ACID TO REMOVE ACID LABILE GROUP FROM POLYMER, QUENCHING AND PRECIPITATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-04-18 US disclosed
EP-0366590-B1 Highly sensitive positive photoresist compositions IBM (US) 1996-03-20 EP disclosed
EP-0607899-A2 Positive photoresist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-07-27 EP disclosed
EP-0556177-A1 TOP COAT FOR ACID CATALYZED RESISTS International Business Machines Corporation (US) 1993-08-25 EP disclosed
WO-1992005474-A1 TOP COAT FOR ACID CATALYZED RESISTS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1992-04-02 WO disclosed
EP-0366590-A2 Highly sensitive positive photoresist compositions International Business Machines Corporation (US) 1990-05-02 EP disclosed