SCHEMBL2156393

SCHEMBL2156393

COC([SiH3])(CCCO)OC

nearest known ligand 0.35

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.35
LMNA P02545 2/20 0.33
ALDH1A1 P00352 2/20 0.33
HSD17B10 Q99714 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
TSHR P16473 1/20 0.33
CYP4F2 P78329 2/20 0.32
CYP4A11 Q02928 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3655924 0.76 TSHR (0.32) LMNATSHR
SCHEMBL57181 0.74 KIF11 (0.32)
SCHEMBL215815 0.74 TSHR (0.30) ALDH1A1TSHR
SCHEMBL30893155 0.72 SMN1; SMN2 (0.38) SMN1; SMN2LMNAALDH1A1HSD17B10MEN1
SCHEMBL23748415 0.72 TSHR (0.40) TSHR
SCHEMBL12806189 0.72 TSHR (0.40) TSHR
SCHEMBL8467117 0.72 ALDH1A1 (0.32) ALDH1A1TSHR
SCHEMBL4232263 0.72 TSHR (0.40) TSHR
SCHEMBL12805505 0.72 TSHR (0.40) TSHR
SCHEMBL56325 0.72 NFKB1 (0.35) LMNAALDH1A1MEN1KMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024071051-A1 CURABLE COMPOSITION 株式会社カネカ 2024-04-04 WO disclosed
WO-2023162664-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-31 WO disclosed
WO-2023145711-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-03 WO disclosed
WO-2023074462-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR 株式会社カネカ 2023-05-04 WO disclosed
WO-2023054700-A1 CURABLE COMPOSITION 株式会社カネカ 2023-04-06 WO disclosed
US-20230076565-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2023-03-09 US disclosed
EP-4134390-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2023-02-15 EP disclosed
EP-4105262-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2022-12-21 EP disclosed
WO-2021261383-A1 THERMALLY CURABLE COMPOSITION AND CURED PRODUCT OF SAME 株式会社カネカ 2021-12-30 WO disclosed
WO-2021162048-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF 株式会社カネカ 2021-08-19 WO disclosed
US-7973108-B2 Curable composition KANEKA CORPORATION (JP) 2011-07-05 US disclosed
EP-1985666-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2010-12-15 EP disclosed
EP-1717240-B1 Organoalkoxysilanes for use in moisture curable compositions SIKA TECHNOLOGY AG (CH) 2010-09-22 EP disclosed
US-20090182099-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-07-16 US disclosed
US-20080319152-A1 Curable Composition KANEKA CORPORATION (JP) 2008-12-25 US disclosed
EP-1985666-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-10-29 EP disclosed
US-20070055038-A1 Adducts containing isocyanate groups and composition adhering effectively to painted substrates SIKA TECHNOLOGY AG (CH) 2007-03-08 US disclosed
EP-1760100-A1 Isocyanate group containing adducts and compositions having good adhesion on coated substrates Sika Technology AG (CH) 2007-03-07 EP disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1717240-A1 Organoalkoxysilanes for use in moisture curable compositions Sika Technology AG (CH) 2006-11-02 EP disclosed