Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.42 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.42 |
| ▸ | TYR | P14679 | 2/20 | 0.40 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.38 |
| ▸ | BID | P55957 | 3/20 | 0.37 |
| ▸ | MCL1 | Q07820 | 3/20 | 0.37 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.37 |
| ▸ | BAK1 | Q16611 | 2/20 | 0.37 |
| ▸ | KAT8 | Q9H7Z6 | 2/20 | 0.37 |
| ▸ | IAPP | P10997 | 1/20 | 0.37 |
| ▸ | PPARG | P37231 | 1/20 | 0.37 |
| ▸ | PPARA | Q07869 | 1/20 | 0.37 |
| ▸ | EP300 | Q09472 | 1/20 | 0.37 |
| ▸ | KAT2A | Q92830 | 1/20 | 0.37 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.37 |
| ▸ | KAT5 | Q92993 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1780725 | 0.88 | LIPG (0.37) | LIPGALOX5PTGS2IAPPPPARG | |
| SCHEMBL3482404 | 0.85 | LIPG (0.44) | LIPGCYP3A4CYP2D6CYP2C9ALOX5 | |
| SCHEMBL17785953 | 0.82 | LIPG (0.42) | LIPGCYP3A4CYP2D6CYP2C9ALOX5 | |
| SCHEMBL13714249 | 0.82 | LIPG (0.44) | LIPGCYP3A4CYP2D6CYP2C9ALOX5 | |
| SCHEMBL4530303 | 0.80 | MPO (0.44) | — | |
| SCHEMBL6114399 | 0.80 | LIPG (0.43) | LIPGCYP3A4CYP2D6CYP2C9ALOX5 | |
| SCHEMBL6841740 | 0.80 | ALDH1A1 (0.35) | LIPG | |
| SCHEMBL4533827 | 0.80 | TAAR1 (0.41) | — | |
| SCHEMBL3482161 | 0.80 | LIPG (0.43) | LIPGCYP3A4CYP2D6CYP2C9ALOX5 | |
| SCHEMBL1917938 | 0.79 | GABRA1 (0.46) | CYP2D6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115151868-A | Photosensitive resin composition, method for sorting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | 昭和电工材料株式会社 | 2022-10-04 | — | — | CN | disclosed |
| WO-2021215374-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 (JP) | 2021-10-28 | — | — | WO | disclosed |
| WO-2021070232-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2021-04-15 | — | — | WO | disclosed |
| WO-2020071204-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020070924-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071437-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN-CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071201-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020031240-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |