SCHEMBL25527441

SCHEMBL25527441

O=C(O)CC(OC(=O)CS)c1cccs1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.36
CES1 P23141 1/20 0.36
KEAP1 Q14145 1/20 0.36
CYP2C19 P33261 1/20 0.35
SLC1A3 P43003 1/20 0.35
SLC1A2 P43004 1/20 0.35
SLC1A1 P43005 1/20 0.35
ALOX5 P09917 1/20 0.34
ALDH1A1 P00352 3/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
MAPT P10636 1/20 0.34
TSHR P16473 1/20 0.34
MGAM O43451 1/20 0.34
GAA P10253 1/20 0.34
SI P14410 1/20 0.34
MGAM2 Q2M2H8 1/20 0.34
FFAR1 O14842 2/20 0.34
RAB9A P51151 2/20 0.33
NPC1 O15118 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6453628 0.82 HSD17B2 (0.42) CES2CES1KEAP1CYP2C19SLC1A3
SCHEMBL6451012 0.78 FFAR1 (0.41) CES2CES1KEAP1CYP2C19SLC1A3
SCHEMBL25527404 0.76 GABBR2 (0.43) CYP2C19MAPTFFAR1
SCHEMBL6461326 0.75 SLC1A3 (0.41) CES2CES1KEAP1CYP2C19SLC1A3
SCHEMBL25527444 0.73 ALOX5 (0.37) CES2CES1SLC1A3SLC1A2SLC1A1
SCHEMBL3133955 0.73 CES2 (0.43) CES2CES1KEAP1CYP2C19ALOX5
SCHEMBL658090 0.72 CES2 (0.46) CES2CES1KEAP1CYP2C19ALOX5
SCHEMBL25527438 0.72 MIF (0.47) CYP2C19SLC1A3SLC1A2SLC1A1ALDH1A1
SCHEMBL657848 0.71 CES2 (0.39) CES2CES1KEAP1CYP2C19ALOX5
SCHEMBL4446826 0.71 CES2 (0.49) CES2CES1KEAP1CYP2C19ALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230152696-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed