SCHEMBL25699178

SCHEMBL25699178

CCC(C)C(=O)Oc1cc(I)cc(I)c1C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 1/20 0.33
▸ POLB P06746 1/20 0.33
▸ APEX1 P27695 1/20 0.33
▸ KMT2A Q03164 1/20 0.33
▸ ATM Q13315 1/20 0.33
▸ ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25468250 0.75 ALDH1A1 (0.43) MAPTPOLBAPEX1KMT2AATM
SCHEMBL25468115 0.74 KDM4E (0.30) —
SCHEMBL24909141 0.73 ELANE (0.36) POLBAPEX1KMT2AATM
SCHEMBL25469952 0.72 — —
SCHEMBL25519396 0.71 KMT2A (0.43) MAPTPOLBAPEX1KMT2AATM
SCHEMBL25519414 0.68 GABRA1 (0.38) MAPTPOLBAPEX1KMT2AATM
SCHEMBL2336086 0.68 TTR (0.46) KMT2A
SCHEMBL15548526 0.68 KMT2A (0.49) MAPTPOLBAPEX1KMT2AATM
SCHEMBL26194898 0.67 ELANE (0.44) MAPTPOLBAPEX1KMT2AATM
SCHEMBL8812365 0.67 SMN1; SMN2 (0.38) MAPTPOLBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221640-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 — — US disclosed
US-20230221640-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-07-13 — — US disclosed
US-20230185192-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-06-15 — — US disclosed
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