SCHEMBL258698

SCHEMBL258698

CC(CCCN1C(=O)C=CC1=O)CN1C(=O)C=CC1=O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 10/20 0.56
FAAH O00519 5/20 0.56
ALDH1A1 P00352 2/20 0.54
LMNA P02545 2/20 0.54
MAPT P10636 2/20 0.54
NPSR1 Q6W5P4 2/20 0.54
HSP90AA1 P07900 1/20 0.54
TLR9 Q9NR96 1/20 0.54
TP53 P04637 1/20 0.54
PKM P14618 1/20 0.54
HPGD P15428 1/20 0.54
XBP1 P17861 1/20 0.54
MAPK1 P28482 1/20 0.54
HTT P42858 1/20 0.54
RECQL P46063 1/20 0.54
RAB9A P51151 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
GPR35 Q9HC97 1/20 0.54
GPR55 Q9Y2T6 1/20 0.54
PTGS1 P23219 7/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL259873 0.94 MGLL (0.59) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL17924906 0.85 MGLL (0.56) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL3677233 0.85 MGLL (0.50) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL5134368 0.83 MGLL (0.42) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL3482198 0.82 MGLL (0.62) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL10074015 0.82 ALDH1A1 (0.38) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL19019377 0.81 MGLL (0.56) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL19019642 0.81 MGLL (0.56) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL10074659 0.81 MGLL (0.56) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL7144432 0.80 MGLL (0.70) MGLLFAAHALDH1A1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 162 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119264155-A Latent curing agent based on dynamic crosslinking-controllable dissolution mechanism 江南大学 2025-01-07 CN claimed
EP-4366024-A1 NON-AQUEOUS ELECTROLYTE AND LITHIUM SECONDARY BATTERY USING SAME LG Energy Solution, Ltd. (KR) 2024-05-08 EP claimed
WO-2023128628-A1 NON-AQUEOUS ELECTROLYTE AND LITHIUM SECONDARY BATTERY USING SAME 주식회사 엘지에너지솔루션 2023-07-06 WO claimed
CN-111732727-B Preparation method of self-repairing crosslinked polyamide 北京化工大学 2022-06-21 CN claimed
US-10646428-B2 Process for cosmetic treatment of keratin materials L'OREAL (FR) 2020-05-12 US claimed
US-20180344617-A1 PROCESS FOR COSMETIC TREATMENT OF KERATIN MATERIALS L'OREAL (FR) 2018-12-06 US claimed
US-10011751-B2 Phosphine-catalyzed, michael addition-curable sulfur-containing polymer compositions PRC-DESOTO INTERNATIONAL, INC. (US) 2018-07-03 US claimed
US-8063161-B2 Low temperature curing acrylate and maleimide based formulations and methods for use thereof DESIGNER MOLECULES, INC. (US) 2011-11-22 US claimed
US-20100063184-A1 LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2010-03-11 US claimed
US-20250270372-A1 BISMALEIMIDE COMPOUND, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT THEREFROM, SEMICONDUCTOR ELEMENT AND DRY FILM RESIST NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-08-28 US disclosed
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-27 US disclosed
CN-119264155-A Latent curing agent based on dynamic crosslinking-controllable dissolution mechanism 江南大学 2025-01-07 CN disclosed
US-12133339-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-10-29 US disclosed
US-20240351981-A1 NOVEL BISMALEIMIDE COMPOUNDS HAVING IMPROVED SOLUBILITY AND THEIR USE IN CURABLE COMPOSITIONS EVONIK OPERATIONS GMBH (DE) 2024-10-24 US disclosed
US-20070278683-A1 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials HENKEL CORPORATION (US) 2007-12-06 US disclosed
US-20070278683-A1 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials HENKEL CORPORATION (US) 2007-12-06 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed
US-7176044-B2 B-stageable die attach adhesives HENKEL CORPORATION (US) 2007-02-13 US disclosed
US-7176044-B2 B-stageable die attach adhesives HENKEL CORPORATION (US) 2007-02-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10646428-B2 Process for cosmetic treatment of keratin materials KRT18, ACR, MMAB MGLL 198/4885FAAH 1694/4885ALDH1A1 435/4885
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device ASH2L, RER1, SEM1 MGLL 3745/4885FAAH 3507/4885ALDH1A1 659/4885
US-20240351981-A1 NOVEL BISMALEIMIDE COMPOUNDS HAVING IMPROVED SOLUBILITY AND THEIR USE IN CURABLE COMPOSITIONS PBRM1, SMCHD1, SMARCE1 MGLL 3949/4885FAAH 1732/4885ALDH1A1 4029/4885
US-20180344617-A1 PROCESS FOR COSMETIC TREATMENT OF KERATIN MATERIALS KRT18, ACR, MMAB MGLL 198/4885FAAH 1694/4885ALDH1A1 435/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.