SCHEMBL26206450

SCHEMBL26206450

CC(C)OC(=O)c1cc(I)ccc1Oc1c(F)c(F)c(S)c(F)c1F

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA12 O43570 6/20 0.36
▸ CA1 P00915 6/20 0.36
▸ CA2 P00918 6/20 0.36
▸ CA7 P43166 6/20 0.36
▸ CA9 Q16790 6/20 0.36
▸ CA14 Q9ULX7 6/20 0.36
▸ ALDH1A1 P00352 5/20 0.33
▸ HPGD P15428 3/20 0.33
▸ HSD17B10 Q99714 2/20 0.33
▸ MAPK1 P28482 1/20 0.33
▸ ABCG2 Q9UNQ0 1/20 0.33
▸ KDM4E B2RXH2 6/20 0.32
▸ CYP1A2 P05177 1/20 0.32
▸ CYP2C9 P11712 1/20 0.32
▸ CYP2C19 P33261 1/20 0.32
▸ NPC1 O15118 1/20 0.31
▸ MAPT P10636 2/20 0.30
▸ PKM P14618 1/20 0.30
▸ GLA P06280 1/20 0.30
▸ HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26206440 0.79 KDM4E (0.33) ALDH1A1KDM4ECYP1A2CYP2C9CYP2C19
SCHEMBL26206418 0.77 MEN1 (0.36) ALDH1A1NPC1MAPTHTTSMN1; SMN2
SCHEMBL232890 0.76 CA12 (0.45) CA12CA1CA2CA7CA9
SCHEMBL26206415 0.75 PDE4D (0.34) CYP1A2CYP2C9CYP2C19PTPN1
SCHEMBL26206416 0.74 PDE4D (0.35) —
SCHEMBL26206436 0.74 S1PR3 (0.30) —
SCHEMBL26208670 0.72 KDM4E (0.34) KDM4EMAPT
SCHEMBL26208675 0.71 TSHR (0.38) ALDH1A1HPGDMAPK1KDM4EMAPT
SCHEMBL8067198 0.70 CA12 (0.70) CA12CA1CA2CA7CA9
SCHEMBL8419945 0.65 CA12 (0.33) CA12CA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162565-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 — — WO disclosed
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