SCHEMBL26208675

SCHEMBL26208675

O=C(OCC1CCCO1)c1cc(I)ccc1Oc1c(F)c(F)c(S)c(F)c1F

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 1/20 0.38
▸ LMNA P02545 4/20 0.37
▸ KMT2A Q03164 3/20 0.37
▸ MAPT P10636 3/20 0.36
▸ SCN9A Q15858 1/20 0.36
▸ ALDH1A1 P00352 2/20 0.36
▸ POLB P06746 3/20 0.36
▸ GAA P10253 2/20 0.35
▸ MEN1 O00255 2/20 0.35
▸ HTR7 P34969 1/20 0.35
▸ SMN1; SMN2 Q16637 2/20 0.35
▸ MAPK1 P28482 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ L3MBTL1 Q9Y468 2/20 0.35
▸ KDM4E B2RXH2 1/20 0.35
▸ ESR1 P03372 1/20 0.35
▸ THRB P10828 1/20 0.35
▸ PKM P14618 1/20 0.35
▸ HPGD P15428 1/20 0.35
▸ NR4A1 P22736 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26206415 0.77 PDE4D (0.34) KMT2AMEN1TDP1
SCHEMBL26206418 0.77 MEN1 (0.36) LMNAKMT2AMAPTALDH1A1POLB
SCHEMBL26206416 0.75 PDE4D (0.35) —
SCHEMBL26206450 0.71 CA12 (0.36) MAPTALDH1A1SMN1; SMN2MAPK1KDM4E
SCHEMBL26206428 0.71 L3MBTL1 (0.38) MAPK1L3MBTL1
SCHEMBL26206440 0.70 KDM4E (0.33) TSHRLMNAKMT2AMAPTALDH1A1
SCHEMBL26208682 0.69 — —
SCHEMBL1063571 0.69 LMNA (0.54) LMNAMAPTALDH1A1POLBKDM4E
SCHEMBL26206438 0.68 SCN9A (0.35) TSHRLMNAKMT2AMAPTSCN9A
SCHEMBL7861790 0.67 ALDH1A1 (0.41) LMNAKMT2AMAPTALDH1A1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162565-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 — — WO disclosed
Send feedback