SCHEMBL26206440

SCHEMBL26206440

O=C(Oc1ccccc1I)c1cc(I)ccc1Oc1c(F)c(F)c(S)c(F)c1F

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 4/20 0.33
▸ MAPT P10636 2/20 0.33
▸ CRHBP P24387 1/20 0.33
▸ CRHR2 Q13324 1/20 0.33
▸ SMN1; SMN2 Q16637 2/20 0.31
▸ MEN1 O00255 1/20 0.31
▸ KMT2A Q03164 1/20 0.31
▸ FABP7 O15540 1/20 0.31
▸ FABP3 P05413 1/20 0.31
▸ FABP5 Q01469 1/20 0.31
▸ TDP1 Q9NUW8 2/20 0.31
▸ TSHR P16473 1/20 0.31
▸ NPSR1 Q6W5P4 1/20 0.31
▸ L3MBTL1 Q9Y468 1/20 0.31
▸ CYP1A2 P05177 3/20 0.31
▸ AR P10275 1/20 0.30
▸ CYP2D6 P10635 2/20 0.30
▸ CYP2C9 P11712 2/20 0.30
▸ CYP2C19 P33261 2/20 0.30
▸ ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26206450 0.79 CA12 (0.36) KDM4EMAPTSMN1; SMN2CYP1A2CYP2C9
SCHEMBL26206418 0.77 MEN1 (0.36) MAPTSMN1; SMN2MEN1KMT2ANPSR1
SCHEMBL26206573 0.76 MAPT (0.48) KDM4EMAPTCRHBPCRHR2KMT2A
SCHEMBL26206415 0.76 PDE4D (0.34) MEN1KMT2ATDP1CYP1A2CYP2D6
SCHEMBL26208670 0.74 KDM4E (0.34) KDM4EMAPTCRHBPCRHR2
SCHEMBL26206416 0.72 PDE4D (0.35) —
SCHEMBL26208675 0.70 TSHR (0.38) KDM4EMAPTSMN1; SMN2MEN1KMT2A
SCHEMBL26208685 0.69 TSHR (0.39) KDM4ESMN1; SMN2MEN1KMT2ATDP1
SCHEMBL7866345 0.63 FABP7 (0.50) KDM4EMAPTSMN1; SMN2MEN1KMT2A
SCHEMBL8272377 0.62 FPR2 (0.47) KDM4ESMN1; SMN2MEN1KMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162565-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 — — WO disclosed
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