SCHEMBL26861530

SCHEMBL26861530

C=C(C)C(=O)OC(C)c1ccc(O)c(OC)c1

nearest known ligand 0.52

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 2/20 0.52
▸ BLM P54132 2/20 0.52
▸ NPSR1 Q6W5P4 1/20 0.52
▸ CYP3A4 P08684 1/20 0.47
▸ NFKB1 P19838 1/20 0.46
▸ GAA P10253 1/20 0.45
▸ SLC22A3 O75751 1/20 0.45
▸ PMP22 Q01453 1/20 0.44
▸ SLC22A6 Q4U2R8 1/20 0.44
▸ SLC22A8 Q8TCC7 1/20 0.44
▸ MEN1 O00255 1/20 0.44
▸ RAB9A P51151 1/20 0.44
▸ KMT2A Q03164 1/20 0.44
▸ PDE4D Q08499 1/20 0.43
▸ CYP19A1 P11511 1/20 0.43
▸ HTT P42858 1/20 0.43
▸ CXCL12 P48061 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26861517 0.85 CA12 (0.46) TSHRBLMCYP3A4NFKB1GAA
SCHEMBL3337932 0.85 TSHR (0.58) TSHRBLMNPSR1CYP3A4NFKB1
SCHEMBL38657965 0.84 HIF1A (0.36) TSHRBLMNPSR1KMT2A
SCHEMBL26816149 0.84 HIF1A (0.36) TSHRBLMNPSR1KMT2A
SCHEMBL26861513 0.82 CA12 (0.37) TSHRBLMNPSR1GAA
SCHEMBL24106321 0.82 CYP3A4 (0.38) TSHRBLMNPSR1CYP3A4HTT
SCHEMBL26861544 0.82 LMNA (0.44) RAB9AKMT2ACYP19A1HTT
SCHEMBL24908563 0.81 TSHR (0.48) TSHRBLMNPSR1CYP3A4NFKB1
SCHEMBL24106304 0.81 FOLH1 (0.40) TSHRBLMNPSR1GAAMEN1
SCHEMBL26794111 0.81 SHBG (0.41) TSHRCYP3A4GAASLC22A6MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
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