SCHEMBL26861544

SCHEMBL26861544

C=C(C)C(=O)OC(C)c1ccc(OC)c(F)c1

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ LMNA P02545 1/20 0.44
▸ MAPK1 P28482 1/20 0.44
▸ HTT P42858 1/20 0.44
▸ RAB9A P51151 1/20 0.44
▸ FFAR1 O14842 1/20 0.39
▸ TAS1R3 Q7RTX0 1/20 0.38
▸ TAS1R1 Q7RTX1 1/20 0.38
▸ CXCR2 P25025 1/20 0.37
▸ KMT2A Q03164 1/20 0.37
▸ TUBB1 Q9H4B7 1/20 0.37
▸ ROCK2 O75116 1/20 0.36
▸ ACACB O00763 1/20 0.36
▸ CHRM4 P08173 1/20 0.36
▸ APP P05067 1/20 0.36
▸ CYP2C19 P33261 1/20 0.36
▸ PTGS2 P35354 1/20 0.36
▸ CYP19A1 P11511 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26794111 0.83 SHBG (0.41) LMNAKMT2AAPPCYP2C19PTGS2
SCHEMBL18240787 0.83 LMNA (0.44) LMNAMAPK1HTTRAB9AFFAR1
SCHEMBL26862711 0.83 LMNA (0.41) LMNAMAPK1HTTRAB9AFFAR1
SCHEMBL26861530 0.82 TSHR (0.52) HTTRAB9AKMT2ACYP19A1
SCHEMBL17844798 0.81 LMNA (0.47) LMNAMAPK1HTTRAB9AFFAR1
SCHEMBL38657965 0.81 HIF1A (0.36) LMNAKMT2ACYP2C19
SCHEMBL26816149 0.81 HIF1A (0.36) LMNAKMT2ACYP2C19
SCHEMBL26059981 0.80 ADRB1 (0.40) APPCYP2C19
SCHEMBL14258939 0.78 TSHR (0.41) HTTKMT2ACYP19A1
SCHEMBL26862030 0.78 PTPN11 (0.35) LMNAAPPCYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
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