SCHEMBL24908563

SCHEMBL24908563

C=C(C)C(=O)OC(c1ccc(O)c(OC)c1)C(F)(F)F

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 2/20 0.48
▸ BLM P54132 2/20 0.48
▸ NPSR1 Q6W5P4 1/20 0.48
▸ CYP3A4 P08684 1/20 0.43
▸ NFKB1 P19838 1/20 0.42
▸ GAA P10253 2/20 0.41
▸ PMP22 Q01453 1/20 0.41
▸ PDE4D Q08499 1/20 0.40
▸ MEN1 O00255 2/20 0.40
▸ KMT2A Q03164 2/20 0.40
▸ SLC22A6 Q4U2R8 1/20 0.40
▸ SLC22A8 Q8TCC7 1/20 0.40
▸ RAB9A P51151 1/20 0.40
▸ CYP19A1 P11511 1/20 0.40
▸ HTT P42858 1/20 0.39
▸ LMNA P02545 1/20 0.39
▸ SLC22A3 O75751 1/20 0.39
▸ BCHE P06276 1/20 0.39
▸ TYR P14679 1/20 0.39
▸ ACHE P22303 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26862498 0.87 CA12 (0.36) TSHRBLMCYP3A4NFKB1GAA
SCHEMBL26862711 0.85 LMNA (0.41) MEN1KMT2ARAB9AHTTLMNA
SCHEMBL24908564 0.84 SHBG (0.38) LMNA
SCHEMBL26794326 0.83 APP (0.34) —
SCHEMBL26861530 0.81 TSHR (0.52) TSHRBLMNPSR1CYP3A4NFKB1
SCHEMBL24908562 0.80 APP (0.40) TSHRBLMCYP3A4NFKB1PMP22
SCHEMBL26862708 0.80 MAPT (0.45) TSHRNPSR1MEN1KMT2ARAB9A
SCHEMBL24908561 0.79 ESR1 (0.43) CYP3A4LMNA
SCHEMBL26862661 0.77 CYP2C9 (0.38) GAAMEN1KMT2A
SCHEMBL26862662 0.77 HSD17B1 (0.38) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
WO-2023157526-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, COMPOUND, AND RESIN 富士フイルム株式会社 2023-08-24 — — WO disclosed
WO-2023002869-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, RESIN, AND METHOD FOR PRODUCING RESIN 富士フイルム株式会社 2023-01-26 — — WO disclosed
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