SCHEMBL24908564

SCHEMBL24908564

C=C(C)C(=O)OC(c1ccc(O)c(F)c1)C(F)(F)F

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SHBG P04278 1/20 0.38
▸ FOLH1 Q04609 1/20 0.34
▸ NR3C1 P04150 4/20 0.32
▸ PGR P06401 3/20 0.32
▸ AR P10275 2/20 0.32
▸ GRIN2B Q13224 2/20 0.31
▸ KDM4E B2RXH2 1/20 0.31
▸ LMNA P02545 1/20 0.31
▸ HSD17B10 Q99714 1/20 0.31
▸ CYP17A1 P05093 1/20 0.31
▸ GRIN1 Q05586 1/20 0.31
▸ CA12 O43570 1/20 0.31
▸ CA1 P00915 1/20 0.31
▸ CA2 P00918 1/20 0.31
▸ CA7 P43166 1/20 0.31
▸ CA9 Q16790 1/20 0.31
▸ CA14 Q9ULX7 1/20 0.31
▸ ESR1 P03372 1/20 0.30
▸ ESR2 Q92731 1/20 0.30
▸ PTGS1 P23219 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26862498 0.89 CA12 (0.36) SHBGKDM4ELMNAHSD17B10CA12
SCHEMBL26794326 0.85 APP (0.34) HSD17B10CA12CA1CA2CA7
SCHEMBL24908563 0.84 TSHR (0.48) LMNA
SCHEMBL26862711 0.84 LMNA (0.41) LMNA
SCHEMBL26794111 0.82 SHBG (0.41) SHBGFOLH1NR3C1PGRAR
SCHEMBL24908561 0.81 ESR1 (0.43) PGRARLMNACA12CA1
SCHEMBL26862661 0.79 CYP2C9 (0.38) KDM4EHSD17B10CA12CA1CA2
SCHEMBL26862662 0.79 HSD17B1 (0.38) GRIN2BESR1ESR2
SCHEMBL26862746 0.78 CYP2C9 (0.40) KDM4EHSD17B10CA12CA1CA2
SCHEMBL5091135 0.77 HPGD (0.41) ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
US-20230367210-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-11-16 — — US disclosed
WO-2023157526-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, COMPOUND, AND RESIN 富士フイルム株式会社 2023-08-24 — — WO disclosed
WO-2023002869-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, RESIN, AND METHOD FOR PRODUCING RESIN 富士フイルム株式会社 2023-01-26 — — WO disclosed
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