SCHEMBL2701036

SCHEMBL2701036

CCCCS(=O)(=O)O/N=C(\C#N)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.41
LMNA P02545 1/20 0.41
MAPK1 P28482 1/20 0.41
PLA2G7 Q13093 1/20 0.39
PTGS2 P35354 6/20 0.36
MAPT P10636 1/20 0.35
CES2 O00748 1/20 0.35
CES1 P23141 1/20 0.35
NPSR1 Q6W5P4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2701039 1.00 ALDH1A1 (0.41) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL28223368 0.95 ALDH1A1 (0.40) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL17557252 0.93 LMNA (0.33) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL18431384 0.93 LMNA (0.33) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL9891194 0.93 LMNA (0.33) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL2702574 0.92 PLA2G7 (0.40) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL2702572 0.92 PLA2G7 (0.40) ALDH1A1LMNAMAPK1PLA2G7PTGS2
SCHEMBL12923559 0.91 SMN1; SMN2 (0.35) ALDH1A1LMNAMAPK1PLA2G7
SCHEMBL46072 0.91 SMN1; SMN2 (0.35) ALDH1A1LMNAMAPK1PLA2G7
SCHEMBL18720502 0.91 SMN1; SMN2 (0.35) ALDH1A1LMNAMAPK1PLA2G7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2447773-B1 Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure FUJIFILM CORP (JP) 2013-07-10 EP disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
EP-2447773-A1 Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus Fujifilm Corporation (JP) 2012-05-02 EP disclosed