Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | PLA2G7 | Q13093 | 1/20 | 0.39 |
| ▸ | PTGS2 | P35354 | 6/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | CES2 | O00748 | 1/20 | 0.35 |
| ▸ | CES1 | P23141 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2701036 | 1.00 | ALDH1A1 (0.41) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL28223368 | 0.95 | ALDH1A1 (0.40) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL17557252 | 0.93 | LMNA (0.33) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL18431384 | 0.93 | LMNA (0.33) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL9891194 | 0.93 | LMNA (0.33) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL2702574 | 0.92 | PLA2G7 (0.40) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL2702572 | 0.92 | PLA2G7 (0.40) | ALDH1A1LMNAMAPK1PLA2G7PTGS2 | |
| SCHEMBL12923559 | 0.91 | SMN1; SMN2 (0.35) | ALDH1A1LMNAMAPK1PLA2G7 | |
| SCHEMBL46072 | 0.91 | SMN1; SMN2 (0.35) | ALDH1A1LMNAMAPK1PLA2G7 | |
| SCHEMBL18720502 | 0.91 | SMN1; SMN2 (0.35) | ALDH1A1LMNAMAPK1PLA2G7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112136081-B | Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel | 富士胶片株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-113946103-B | Dry film resist, method for manufacturing circuit wiring, input device, and display device | 富士胶片株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-106959585-B | Positive photosensitive transfer material and method for producing circuit wiring | 富士胶片株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-113946103-A | Dry film resist, method for manufacturing circuit wiring, input device, and display device | 富士胶片株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-107015437-B | Dry film resist, method for manufacturing circuit wiring, input device, and display device | 富士胶片株式会社 | 2021-11-16 | — | — | CN | disclosed |
| CN-107132731-B | Photosensitive transfer material and method for manufacturing circuit wiring | 富士胶片株式会社 | 2021-10-15 | — | — | CN | disclosed |
| CN-106687865-B | TFT substrate, organic EL display device, and method for manufacturing liquid crystal display device | 富士胶片株式会社 | 2020-01-03 | — | — | CN | disclosed |
| US-10289001-B2 | Pattern forming method, etching method and method for producing capacitance-type input device | FUJIFILM CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-20190011833-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, PATTERN FORMATION METHOD, AND ETCHING METHOD | FUJIFILM CORPORATION (JP) | 2019-01-10 | — | — | US | disclosed |
| US-10108091-B2 | Photosensitive transfer material, pattern formation method, and etching method | FUJIFILM CORPORATION (JP) | 2018-10-23 | — | — | US | disclosed |
| US-9810984-B2 | Photosensitive transfer material, pattern formation method, and etching method | FUJIFILM CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-20170199458-A1 | PATTERN FORMING METHOD, ETCHING METHOD AND METHOD FOR PRODUCING CAPACITANCE-TYPE INPUT DEVICE | FUJIFILM CORPORATION (JP) | 2017-07-13 | — | — | US | disclosed |
| US-20160291468-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, PATTERN FORMATION METHOD, AND ETCHING METHOD | FUJIFILM CORPORATION (JP) | 2016-10-06 | — | — | US | disclosed |
| US-20150219993-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, PATTERN FORMATION METHOD, AND ETCHING METHOD | FUJIFILM CORPORATION (JP) | 2015-08-06 | — | — | US | disclosed |
| EP-2447773-B1 | Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure | FUJIFILM CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-20120107563-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS | FUJIFILM CORPORATION (JP) | 2012-05-03 | — | — | US | disclosed |
| EP-2447773-A1 | Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus | Fujifilm Corporation (JP) | 2012-05-02 | — | — | EP | disclosed |