SCHEMBL2708147

SCHEMBL2708147

Nc1ccc(Oc2cccc(Oc3ccc(N)c(O)c3C3C4CC5CC(C4)CC3C5)c2)c(C2C3CC4CC(C3)CC2C4)c1O

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FURIN P09958 2/20 0.36
MAPT P10636 3/20 0.34
L3MBTL1 Q9Y468 2/20 0.34
NPSR1 Q6W5P4 1/20 0.34
ALDH1A1 P00352 3/20 0.33
GAA P10253 2/20 0.33
SMN1; SMN2 Q16637 3/20 0.33
MEN1 O00255 1/20 0.33
MITF O75030 1/20 0.33
GFER P55789 1/20 0.33
KMT2A Q03164 1/20 0.33
NLRP1 Q9C000 1/20 0.33
NOD2 Q9HC29 1/20 0.33
F10 P00742 1/20 0.32
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
CYP2C9 P11712 1/20 0.31
CYP2C19 P33261 1/20 0.31
HTT P42858 1/20 0.31
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2706862 0.77 KDM4E (0.38) MAPTSMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL2708129 0.76 MEN1 (0.33) MAPTL3MBTL1ALDH1A1GAAMEN1
SCHEMBL2708206 0.76 MMP2 (0.34)
SCHEMBL2709058 0.76 FURIN (0.36) FURINMAPTL3MBTL1NPSR1ALDH1A1
SCHEMBL2709190 0.75 CHRNB2 (0.34) CYP3A4POLB
SCHEMBL2747649 0.74 ALDH1A1 (0.38) L3MBTL1ALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL2708497 0.70 SLC6A2 (0.43) MAPTPOLB
SCHEMBL2711010 0.69 CHRNB2 (0.35) CYP3A4CYP2C9POLB
SCHEMBL2709273 0.68 MMP2 (0.36) CYP3A4
SCHEMBL2746690 0.65 MMP2 (0.34) GAAF10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed