SCHEMBL2708129

SCHEMBL2708129

Nc1ccc(Oc2cc(Oc3ccc(N)c(O)c3C3C4CC5CC(C4)CC3C5)c(C34CC5CC(CC(C5)C3)C4)cc2C23CC4CC(CC(C4)C2)C3)c(C2C3CC4CC(C3)CC2C4)c1O

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.33
KMT2A Q03164 3/20 0.33
RARA P10276 2/20 0.33
RARB P10826 2/20 0.33
RARG P13631 2/20 0.33
LMNA P02545 2/20 0.33
NR1I2 O75469 1/20 0.33
PGR P06401 1/20 0.33
HSPD1 P10809 1/20 0.33
GOT1 P17174 1/20 0.33
GLRA1 P23415 1/20 0.33
BLM P54132 1/20 0.33
HSPE1 P61604 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
GAA P10253 2/20 0.31
POLB P06746 1/20 0.31
GFER P55789 1/20 0.31
HDAC11 Q96DB2 2/20 0.31
HDAC2 Q92769 1/20 0.31
ALDH1A1 P00352 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708147 0.76 FURIN (0.36) MEN1KMT2AGAAPOLBGFER
SCHEMBL2708132 0.75 MEN1 (0.38) MEN1KMT2ARARARARBRARG
SCHEMBL2747649 0.74 ALDH1A1 (0.38) MEN1KMT2ALMNAPGRALDH1A1
SCHEMBL2707709 0.74 MEN1 (0.38) MEN1KMT2ARARARARBRARG
SCHEMBL2706862 0.70 KDM4E (0.38) MEN1KMT2ALMNAKDM4EMAPT
SCHEMBL2708126 0.69 RARA (0.33) MEN1KMT2ARARARARBRARG
SCHEMBL2707687 0.68 ALDH1A1 (0.50) MEN1KMT2ARARARARBRARG
SCHEMBL2709058 0.66 FURIN (0.36) MEN1KMT2ALMNAGAAPOLB
SCHEMBL2709184 0.65 FAAH (0.39) MEN1KMT2ARARARARBRARG
SCHEMBL3185036 0.65 MMP2 (0.33) MEN1KMT2ARARARARBRARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed