SCHEMBL2708150

SCHEMBL2708150

Nc1cc(C23CC4CC(CC(C4)C2)C3)c(Oc2cccc(Oc3cc(O)c(N)cc3C34CC5CC(CC(C5)C3)C4)c2)cc1O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 6/20 0.37
KMT2A Q03164 6/20 0.37
GAA P10253 3/20 0.37
GFER P55789 2/20 0.37
POLB P06746 1/20 0.37
RARB P10826 6/20 0.35
ALDH1A1 P00352 5/20 0.35
RARA P10276 4/20 0.35
RARG P13631 4/20 0.35
MAPT P10636 3/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
KDM4E B2RXH2 1/20 0.35
TP53 P04637 1/20 0.35
CYP3A4 P08684 1/20 0.35
HPGD P15428 1/20 0.35
ALOX15 P16050 1/20 0.35
ALOX12 P18054 1/20 0.35
MAPK1 P28482 1/20 0.35
HSD17B10 Q99714 1/20 0.35
LMNA P02545 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708132 0.85 MEN1 (0.38) MEN1KMT2AGAAGFERPOLB
SCHEMBL2707709 0.83 MEN1 (0.38) MEN1KMT2AGAAGFERPOLB
SCHEMBL2709184 0.82 FAAH (0.39) MEN1KMT2AGAAGFERPOLB
SCHEMBL2747646 0.80 ALDH1A1 (0.40) MEN1KMT2AGAAGFERPOLB
SCHEMBL2709890 0.80 ALDH1A1 (0.42) MEN1KMT2AGAAGFERPOLB
SCHEMBL2709061 0.77 MEN1 (0.38) MEN1KMT2AGAAGFERPOLB
SCHEMBL2709058 0.77 FURIN (0.36) MEN1KMT2AGAAGFERPOLB
SCHEMBL2747092 0.77 ALDH1A1 (0.39) MEN1KMT2AGAAGFERPOLB
SCHEMBL2709894 0.76 ALDH1A1 (0.43) MEN1KMT2AGAAGFERALDH1A1
SCHEMBL28790866 0.75 MEN1 (0.44) MEN1KMT2AGAAGFERPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed