SCHEMBL2710464

SCHEMBL2710464

O=C(O)c1cc(C#Cc2ccc(C3C4CC5CC(C4)CC3C5)cc2)cc(C(=O)O)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
P2RY14 Q15391 2/20 0.41
FFAR1 O14842 5/20 0.39
RARB P10826 5/20 0.36
RARG P13631 5/20 0.36
RARA P10276 2/20 0.36
CYP26A1 O43174 1/20 0.36
CYP3A4 P08684 1/20 0.36
CRABP2 P29373 1/20 0.36
HSD11B1 P28845 1/20 0.34
PTPN11 Q06124 1/20 0.34
TEAD1 P28347 1/20 0.33
KDM4E B2RXH2 1/20 0.33
MEN1 O00255 1/20 0.33
NPC1 O15118 1/20 0.33
LMNA P02545 1/20 0.33
MAPT P10636 1/20 0.33
CASP3 P42574 1/20 0.33
RAB9A P51151 1/20 0.33
KMT2A Q03164 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709664 0.92 MMP13 (0.38) P2RY14FFAR1RARBRARGRARA
SCHEMBL2709577 0.82 FFAR1 (0.37) FFAR1RARBRARGRARACYP26A1
SCHEMBL2707815 0.82 FFAR1 (0.37) FFAR1RARBRARGRARACYP26A1
SCHEMBL2709679 0.82 HNF4A (0.43) FFAR1RARBRARGRARACYP26A1
SCHEMBL2707894 0.76 MMP13 (0.36) FFAR1RARBRARGRARACYP26A1
SCHEMBL2709279 0.76 MMP13 (0.36) FFAR1RARBRARGRARACYP26A1
SCHEMBL2708869 0.76 HSD11B1 (0.33) HSD11B1NPC1RAB9AKMT2A
SCHEMBL2709336 0.76 RARB (0.41) P2RY14FFAR1RARBRARGRARA
SCHEMBL18604545 0.76 RARB (0.50) P2RY14FFAR1RARBRARGRARA
SCHEMBL2708194 0.76 POLB (0.39) FFAR1PTPN11LMNAHNF4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed