Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6433749 | 0.89 | ESR1 (0.39) | ESR1 | |
| SCHEMBL15737438 | 0.83 | ORAI1 (0.39) | — | |
| SCHEMBL1686464 | 0.83 | ACHE (0.50) | — | |
| SCHEMBL4513203 | 0.83 | MAPT (0.50) | — | |
| SCHEMBL13429477 | 0.83 | CYP2A6 (0.50) | — | |
| SCHEMBL273507 | 0.81 | ESR1 (0.42) | ESR1 | |
| SCHEMBL6434753 | 0.80 | APP (0.39) | ESR1 | |
| SCHEMBL6434758 | 0.80 | APP (0.39) | ESR1 | |
| SCHEMBL6436423 | 0.80 | APP (0.41) | — | |
| SCHEMBL4535157 | 0.76 | CYP3A4 (0.58) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12386256-B2 | Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12386257-B2 | Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| US-20240361697-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-31 | — | — | US | disclosed |
| US-20240352275-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-24 | — | — | US | disclosed |
| US-20240240061-A1 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | RESONAC CORPORATION (JP) | 2024-07-18 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1345280-B1 | Solid electrolyte with nanometre size pores | TOYOTA CHUO KENKYUSHO KK (JP) | 2007-08-01 | — | — | EP | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
| EP-1276807-B1 | CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS | DOW CORNING (US) | 2005-10-12 | — | — | EP | disclosed |
| US-6780471-B2 | USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING | DOW CORNING CORPORATION | 2004-08-24 | — | — | US | disclosed |
| US-20030175569-A1 | Membrane electrode assembly, fuel cell, electrolytic cell, and solid electrolyte | KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO (JP) | 2003-09-18 | — | — | US | disclosed |
| EP-1345280-A1 | Solid electrolyte with nanometre size pores | KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO (JP) | 2003-09-17 | — | — | EP | disclosed |
| US-20030130389-A1 | Curable silicone resin composition and reactive silicon compounds | DOW CORNING LIMITED (GB) | 2003-07-10 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | ESR1 254/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.