SCHEMBL272887

SCHEMBL272887

CC[Si](O)(O)c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.39
ESR2 Q92731 1/20 0.39
TP53 P04637 1/20 0.38
LMNA P02545 1/20 0.36
NR1H2 P55055 2/20 0.35
NR1H3 Q13133 2/20 0.35
MAPT P10636 1/20 0.35
ATM Q13315 1/20 0.34
CES2 O00748 3/20 0.33
CES1 P23141 3/20 0.33
NR1I2 O75469 1/20 0.33
TSHR P16473 2/20 0.32
ALDH1A1 P00352 1/20 0.32
GLA P06280 1/20 0.32
PSIP1 O75475 1/20 0.32
POLB P06746 1/20 0.31
PCSK9 Q8NBP7 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL272869 0.86 ESR1 (0.46) ESR1ESR2NR1H2NR1H3
SCHEMBL272865 0.80 ESR1 (0.37) ESR1ESR2TP53LMNANR1H2
SCHEMBL2023133 0.79 ESR1 (0.39) ESR1ESR2TP53LMNANR1H2
SCHEMBL272316 0.79 ESR1 (0.39) ESR1ESR2TP53LMNANR1H2
SCHEMBL272424 0.77 ESR1 (0.43) ESR1ESR2TP53LMNANR1H2
SCHEMBL272398 0.77 PCSK9 (0.39) NR1H2NR1H3CES2CES1NR1I2
SCHEMBL988676 0.75 NR1H2 (0.43) ESR1ESR2TP53LMNANR1H2
SCHEMBL27548936 0.74 LOXL2 (0.38) ESR1ESR2NR1H2NR1H3MAPT
SCHEMBL28743025 0.73 NAAA (0.43) CES2CES1ALDH1A1
SCHEMBL273159 0.73 ESR1 (0.35) ESR1ESR2LMNANR1H2NR1H3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 169 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110105914-A A kind of high grade of transparency organic silicon potting adhesive 罗青菊 2019-08-09 CN claimed
CN-106674441-B A kind of water-soluble acrylic modified epoxy ester resin and preparation method thereof 湘江涂料科技有限公司 2019-07-23 CN claimed
CN-106674441-A Water-soluble acrylate modified epoxy ester resin and preparation method thereof 湘江涂料科技有限公司 2017-05-17 CN claimed
CN-103059573-B The LED material of inorganic/organic hybrid nanocomposite and preparation thereof GUANGZHOU CHEMISTRY CO., LTD. CHINESE ACADEMY OF SCIENCES (CN) 2015-08-05 CN claimed
CN-102977554-B Epoxy/organosilicon co-curing composite material for LED packaging and preparation method CAS GUANGZHOU CHEMISTRY CO LTD 2015-02-04 CN claimed
CN-102585228-B Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof CAS GUANGZHOU CHEMISTRY CO LTD 2013-12-25 CN claimed
CN-103059573-A Inorganic/organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same CAS GUANGZHOU CHEMISTRY CO LTD 2013-04-24 CN claimed
CN-102977554-A Epoxy/organosilicon co-curing composite material for LED packaging and preparation method CAS GUANGZHOU CHEMISTRY CO LTD 2013-03-20 CN claimed
CN-102585228-A Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof CAS GUANGZHOU CHEMISTRY CO LTD 2012-07-18 CN claimed
US-4039666-A ANTICONVULSANT PHENYLSILANES DOW CORNING CORPORATION (US) 1977-08-02 US claimed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component HD MICROSYSTEMS, LTD. (JP) 2026-04-14 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed
EP-0158733-A1 Polyestercarbonate/polyetherimide blends GENERAL ELECTRIC COMPANY (US) 1985-10-23 EP disclosed
US-4286083-A REACTING A DIOL, A DICARBOXYLIC ACID, AND PHOSGENE IN WATER, TERTIARY AMINE CATALYST GENERAL ELECTRIC COMPANY (US) 1981-08-25 US disclosed
US-4130548-A Preparation of polyester carbonates from polyanhydride ester intermediates GENERAL ELECTRIC (US) 1978-12-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 ESR1 3154/4885ESR2 1998/4885TP53 4756/4885
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component ARCN1, P4HA1, COL1A1 ESR1 254/4885ESR2 243/4885TP53 4731/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 ESR1 1779/4885ESR2 1941/4885TP53 4826/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.