SCHEMBL273497

SCHEMBL273497

CC(C)[Si](O)(c1ccccc1)c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
NR1H2 P55055 2/20 0.35
NR1H3 Q13133 2/20 0.35
LMNA P02545 2/20 0.34
KDM4E B2RXH2 2/20 0.34
ADRA2A P08913 1/20 0.34
ADRA2C P18825 1/20 0.34
HIF1A Q16665 1/20 0.34
ALDH1A1 P00352 2/20 0.33
ALOX5 P09917 1/20 0.33
CACNA2D1 P54289 1/20 0.33
CACNB2 Q08289 1/20 0.33
CACNA1C Q13936 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
CHRM2 P08172 1/20 0.32
ADRA1A P35348 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL271794 0.79 ESR1 (0.39) ESR1ESR2NR1H2NR1H3LMNA
SCHEMBL2021132 0.79 ESR1 (0.39) ESR1ESR2NR1H2NR1H3LMNA
SCHEMBL25911995 0.78 ADRA2C (0.40) ESR1ESR2LMNAKDM4EADRA2A
SCHEMBL25909654 0.78 ADRA2C (0.40) ESR1ESR2LMNAKDM4EADRA2A
SCHEMBL273488 0.77 ESR1 (0.43) ESR1ESR2NR1H2NR1H3LMNA
SCHEMBL28174625 0.77 LMNA (0.40) ESR1ESR2LMNAADRA2AALDH1A1
SCHEMBL29141578 0.75 MAOB (0.33) ESR1ESR2NR1H2NR1H3ADRA2A
SCHEMBL29141573 0.75 ESR1 (0.33) ESR1ESR2NR1H2NR1H3LMNA
SCHEMBL26452940 0.73 ESR1 (0.36) ESR1ESR2NR1H2NR1H3LMNA
SCHEMBL19392079 0.73 LMNA (0.41) ESR1ESR2NR1H2NR1H3LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 157 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component HD MICROSYSTEMS, LTD. (JP) 2026-04-14 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
US-20250370339-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-04 US disclosed
US-20250362601-A1 Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component HD MICROSYSTEMS LTD (JP) 2025-11-27 US disclosed
US-20250341778-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-11-06 US disclosed
US-12405198-B2 Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device RESONAC CORPORATION (JP) 2025-09-02 US disclosed
US-12386259-B2 Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-12 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed
EP-1329160-A2 4-ACYLAMINOPYRAZOLE DERIVATIVES Sankyo Company, Limited (JP) 2003-07-23 EP disclosed
US-5670489-A USEFUL IN TREATMENT OF DISEASES WHICH ARE MODULATED BY PROTEINS, OR IN TREATMENT OF VIRUSES SUCH AS INFLUENZA, HERPES, AND HIV NOVARTIS CORPORATION (US) 1997-09-23 US disclosed
US-5508270-A Nucleoside phosphinate compounds and compositions CIBA-GEIGY CORPORATION (US) 1996-04-16 US disclosed
US-5466677-A Dinucleoside phosphinates and their pharmaceutical compositions CIBA-GEIGY CORPORATION (US) 1995-11-14 US disclosed
EP-0614906-A1 Mononucleotide analogues and intermediates therefor CIBA-GEIGY AG (CH) 1994-09-14 EP disclosed
EP-0614907-A1 Dinucleotide and oligonucleotide analogues CIBA-GEIGY AG (CH) 1994-09-14 EP disclosed
US-5100762-A Radiation-sensitive polymer and radiation-sensitive composition containing the same MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-03-31 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 ESR1 3154/4885ESR2 1998/4885NR1H2 3199/4885
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component ARCN1, P4HA1, COL1A1 ESR1 254/4885ESR2 243/4885NR1H2 141/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 ESR1 1779/4885ESR2 1941/4885NR1H2 4231/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.