Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 1/20 | 0.46 |
| ▸ | RAB9A | P51151 | 1/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.44 |
| ▸ | RAD52 | P43351 | 1/20 | 0.43 |
| ▸ | IDO1 | P14902 | 1/20 | 0.43 |
| ▸ | TDO2 | P48775 | 1/20 | 0.43 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.42 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.42 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.42 |
| ▸ | SQOR | Q9Y6N5 | 1/20 | 0.42 |
| ▸ | TP53 | P04637 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.41 |
| ▸ | PDE4B | Q07343 | 2/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | GAA | P10253 | 1/20 | 0.41 |
| ▸ | PDE4A | P27815 | 1/20 | 0.41 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24747126 | 0.88 | SQOR (0.44) | NPC1RAB9ASMN1; SMN2ALDH1A1SQOR | |
| SCHEMBL13744810 | 0.85 | TP53 (0.51) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL29788008 | 0.84 | HDAC4 (0.53) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL4579619 | 0.84 | HDAC4 (0.53) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL28081752 | 0.81 | ALOX5AP (0.48) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL3643547 | 0.81 | NPC1 (0.54) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL4603322 | 0.80 | CA1 (0.49) | NPC1RAB9AALDH1A1MAPTPDE4B | |
| SCHEMBL24521850 | 0.79 | ALOX5AP (0.43) | SMN1; SMN2ALDH1A1IDO1SQORMAPT | |
| SCHEMBL16055930 | 0.79 | ALDH1A1 (0.46) | NPC1RAB9ASMN1; SMN2ALDH1A1POLB | |
| SCHEMBL21638050 | 0.79 | TDO2 (0.47) | NPC1RAB9ASMN1; SMN2ALDH1A1IDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109486459-A | A kind of no xanthochromia, wet-heat resisting low-temperature setting adhesive and preparation method thereof | 烟台信友新材料有限公司 | 2019-03-19 | — | — | CN | claimed |
| CN-109705751-A | Solvent type double faced adhesive tape, adhesive tape adhesive and preparation method | 江阴美源实业有限公司 | 2019-05-03 | — | — | CN | disclosed |
| CN-109486459-A | A kind of no xanthochromia, wet-heat resisting low-temperature setting adhesive and preparation method thereof | 烟台信友新材料有限公司 | 2019-03-19 | — | — | CN | disclosed |
| CN-107614567-A | EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | 日本化药株式会社 | 2018-01-19 | — | — | CN | disclosed |
| CN-104341581-B | Composition epoxy resin and its solidfied material | 新日铁住金化学株式会社 | 2018-01-09 | — | — | CN | disclosed |
| CN-106661200-A | Epoxy resin composition, resin sheet, and prepreg, and metal-clad laminate board, printed circuit board, and semiconductor device | 日本化药株式会社 | 2017-05-10 | — | — | CN | disclosed |
| CN-103980103-B | PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF | 日本化药株式会社 | 2017-04-12 | — | — | CN | disclosed |
| CN-106543941-A | Automobile epoxy bond compositionss and the adhesive method using this | (株)利来化学商社 | 2017-03-29 | — | — | CN | disclosed |
| CN-104245775-B | Composition epoxy resin and solidfied material | 新日铁住金化学株式会社 | 2016-08-17 | — | — | CN | disclosed |
| CN-103906782-B | Epoxy resin, epoxy resin composition, and cured product thereof | 日本化药株式会社 | 2016-08-17 | — | — | CN | disclosed |
| CN-102532480-A | Providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity | NIPPON STEEL CHEMICAL CO | 2012-07-04 | — | — | CN | disclosed |
| CN-101667563-B | Semiconductor device and method for manufacturing the same, and semiconductor sealing resin | HITACHI LTD | 2012-05-16 | — | — | CN | disclosed |
| CN-102143986-A | Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element | NIPPON KAYAKU KK | 2011-08-03 | — | — | CN | disclosed |
| CN-101768245-A | Naphthol resin, epoxy resin, epoxy resin composition, and solidified products thereof | NIPPON STEEL CHEMICAL CO | 2010-07-07 | — | — | CN | disclosed |
| CN-101667563-A | Semiconductor device and method for manufacturing the same, and semiconductor sealing resin | HITACHI LTD | 2010-03-10 | — | — | CN | disclosed |
| CN-101291971-A | Epoxy resin, epoxy resin composition, photosensitive resin composition and cured article obtained therefrom | NIPPON KAYAKU KK (JP) | 2008-10-22 | — | — | CN | disclosed |
| CN-100363320-C | Method for producing aromatic aldehyde | IHARA CHEMICAL IND CO (JP) | 2008-01-23 | — | — | CN | disclosed |
| CN-1819984-A | Method for producing aromatic aldehyde | IHARA CHEMICAL IND CO (JP) | 2006-08-16 | — | — | CN | disclosed |
| CN-1080733-C | Epoxy resin, epoxy resin composition and hardened product thereof | NIPPON KAYAKU KK (JP) | 2002-03-13 | — | — | CN | disclosed |
| CN-1160724-A | Epoxy resin, epoxy resin composition and hardened product thereof | NIPPON KAYAKU KK (JP) | 1997-10-01 | — | — | CN | disclosed |