SCHEMBL27437211

SCHEMBL27437211

CC(C)OCC(=O)OC(C1CCCCC1)C1CCCCC1

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 2/20 0.36
EPHX1 P07099 4/20 0.34
CA12 O43570 2/20 0.34
CA1 P00915 2/20 0.34
CA2 P00918 2/20 0.34
MMP2 P08253 2/20 0.34
CA9 Q16790 2/20 0.34
CTSK P43235 2/20 0.33
CTSL P07711 2/20 0.33
CTSB P07858 2/20 0.33
LMNA P02545 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
SCN1A P35498 1/20 0.33
SCN2A Q99250 1/20 0.33
SCN3A Q9NY46 1/20 0.33
EPHX2 P34913 1/20 0.33
CTSH P09668 1/20 0.33
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15219463 0.79 SHBG (0.40) NPSR1EPHX1CTSKEPHX2ALDH1A1
SCHEMBL3858544 0.79 EPHX1 (0.40) EPHX1LMNAEPHX2ALDH1A1
SCHEMBL27436820 0.77 EPHX1 (0.40) NPSR1EPHX1CA12CA1CA2
SCHEMBL11379738 0.76 NAAA (0.49) EPHX1CA12CA1CA2CA9
SCHEMBL5988036 0.76 EPHX1 (0.38) NPSR1EPHX1LMNAEPHX2ALDH1A1
SCHEMBL14504448 0.74 NAAA (0.38) EPHX1
SCHEMBL1311829 0.74 LMNA (0.45) NPSR1CA12CA1CA2CA9
SCHEMBL9608683 0.73 EPHX1 (0.39) NPSR1EPHX1CA12CA1CA2
SCHEMBL3858547 0.73 LMNA (0.51) EPHX1LMNAEPHX2ALDH1A1
SCHEMBL9609345 0.72 TSHR (0.44) EPHX1CA12CA1CA2MMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed