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SCHEMBL2747142

SCHEMBL2747142

CC12CC3CC(C)(C1)CC(c1cc(N)c(O)cc1Oc1ccc(C45CC6(C)CC(C)(C4)CC(C47CC8(C)CC(C)(CC(c9ccc(Oc%10cc(O)c(N)cc%10C%10%11CC%12CC(C)(CC(C)(C%12)C%10)C%11)cc9)(C8)C4)C7)(C6)C5)cc1)(C3)C2

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
▸ PTPN11 Q06124 1/20 0.32
▸ NR0B2 Q15466 1/20 0.32
▸ EPHX2 P34913 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2707983 0.81 PTPN11 (0.36) PTPN11NR0B2EPHX2
SCHEMBL2746058 0.79 RXRA (0.43) PTPN11NR0B2
SCHEMBL2747646 0.78 ALDH1A1 (0.40) —
SCHEMBL2746942 0.78 MMP2 (0.39) —
SCHEMBL2747092 0.77 ALDH1A1 (0.39) —
SCHEMBL2708094 0.76 PTPN11 (0.44) PTPN11NR0B2EPHX2
SCHEMBL2709408 0.74 PTPN11 (0.35) PTPN11NR0B2EPHX2
SCHEMBL2730836 0.74 EPHX2 (0.34) PTPN11NR0B2EPHX2
SCHEMBL2747766 0.70 ALDH1A1 (0.38) —
SCHEMBL2709168 0.70 RXRA (0.54) PTPN11NR0B2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 — — US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 — — US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 — — US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 — — US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 — — EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 — — EP disclosed