SCHEMBL27787872

SCHEMBL27787872

CCCCc1cc(C)cc(Cn2nnc3ccccc32)c1O

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 1/20 0.53
▸ SLC9A1 P19634 8/20 0.52
▸ ATM Q13315 1/20 0.51
▸ KMT2A Q03164 2/20 0.45
▸ ALDH1A1 P00352 1/20 0.45
▸ LMNA P02545 1/20 0.45
▸ TP53 P04637 1/20 0.45
▸ HPGD P15428 1/20 0.45
▸ TSHR P16473 1/20 0.45
▸ GRM2 Q14416 1/20 0.45
▸ BRD4 O60885 1/20 0.45
▸ RAB9A P51151 2/20 0.44
▸ MEN1 O00255 1/20 0.44
▸ NPC1 O15118 1/20 0.43
▸ MGAM O43451 1/20 0.43
▸ AMY1A P0DUB6 1/20 0.43
▸ GAA P10253 1/20 0.43
▸ SI P14410 1/20 0.43
▸ SMN1; SMN2 Q16637 1/20 0.43
▸ MGAM2 Q2M2H8 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20815428 0.90 KCNMA1 (0.64) KCNMA1SLC9A1ATMKMT2AALDH1A1
SCHEMBL27787691 0.86 ATM (0.64) KCNMA1SLC9A1ATMKMT2AALDH1A1
SCHEMBL8067247 0.81 KCNMA1 (0.47) KCNMA1SLC9A1TSHRSMN1; SMN2
SCHEMBL27787690 0.79 KCNMA1 (0.60) KCNMA1SLC9A1ATMGRM2BRD4
SCHEMBL29839046 0.77 KCNMA1 (0.69) KCNMA1SLC9A1ATMKMT2AALDH1A1
SCHEMBL5814955 0.77 SLC9A1 (0.45) KCNMA1SLC9A1ALDH1A1HPGDTSHR
SCHEMBL280118 0.72 TYR (0.48) KMT2AALDH1A1TP53HPGDTSHR
SCHEMBL23299012 0.72 KCNMA1 (0.54) KCNMA1SLC9A1ATMKMT2AALDH1A1
SCHEMBL10884371 0.71 KCNMA1 (0.47) KCNMA1SLC9A1
SCHEMBL5373461 0.71 NPC1 (0.58) ALDH1A1LMNAHPGDRAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101809064-B Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device ASAHI KASEI E MATERIALS CORP 2012-06-13 — — CN disclosed
CN-101809064-A Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device ASAHI KASEI E MATERIALS CORP 2010-08-18 — — CN disclosed
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