SCHEMBL29839046

SCHEMBL29839046

Cc1ccc(O)c(Cn2nnc3ccccc32)c1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 1/20 0.69
▸ BRD4 O60885 1/20 0.56
▸ ATM Q13315 1/20 0.54
▸ SLC9A1 P19634 4/20 0.52
▸ GRM2 Q14416 1/20 0.51
▸ GAA P10253 3/20 0.51
▸ NPC1 O15118 3/20 0.51
▸ RAB9A P51151 3/20 0.51
▸ HPGD P15428 2/20 0.51
▸ ALDH1A1 P00352 1/20 0.51
▸ LMNA P02545 1/20 0.51
▸ TP53 P04637 1/20 0.51
▸ TSHR P16473 1/20 0.51
▸ KMT2A Q03164 1/20 0.51
▸ MGAM O43451 1/20 0.51
▸ AMY1A P0DUB6 1/20 0.51
▸ SI P14410 1/20 0.51
▸ SMN1; SMN2 Q16637 1/20 0.51
▸ MGAM2 Q2M2H8 1/20 0.51
▸ POLB P06746 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20815428 0.86 KCNMA1 (0.64) KCNMA1BRD4ATMSLC9A1GRM2
SCHEMBL23299012 0.83 KCNMA1 (0.54) KCNMA1ATMSLC9A1GRM2GAA
SCHEMBL27787690 0.80 KCNMA1 (0.60) KCNMA1BRD4ATMSLC9A1GRM2
SCHEMBL23058946 0.77 KCNMA1 (0.50) KCNMA1BRD4ATMSLC9A1GRM2
SCHEMBL27787872 0.77 KCNMA1 (0.53) KCNMA1BRD4ATMSLC9A1GRM2
SCHEMBL22000732 0.76 GRM2 (0.75) KCNMA1SLC9A1GRM2GAANPC1
SCHEMBL3878065 0.75 KCNMA1 (0.80) KCNMA1BRD4ATMSLC9A1GRM2
SCHEMBL7599503 0.75 SLC9A1 (0.69) SLC9A1GRM2NPC1RAB9AHPGD
SCHEMBL11466945 0.75 LMNA (0.55) GAANPC1RAB9AHPGDALDH1A1
SCHEMBL29845601 0.72 KCNMA1 (0.67) KCNMA1ATMSLC9A1GAANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11819955-B2 Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device SENJU METAL INDUSTRY CO., LTD. (JP) 2023-11-21 — — US disclosed
US-20220250194-A1 SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ON-BOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ON-BOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE SENJU METAL INDUSTRY CO., LTD. (JP) 2022-08-11 — — US disclosed
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