Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.64 |
| ▸ | KCNMA1 | Q12791 | 1/20 | 0.60 |
| ▸ | SLC9A1 | P19634 | 8/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.54 |
| ▸ | LMNA | P02545 | 1/20 | 0.54 |
| ▸ | TP53 | P04637 | 1/20 | 0.54 |
| ▸ | HPGD | P15428 | 1/20 | 0.54 |
| ▸ | TSHR | P16473 | 1/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.54 |
| ▸ | GRM2 | Q14416 | 2/20 | 0.48 |
| ▸ | BRD4 | O60885 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.45 |
| ▸ | PTK2 | Q05397 | 1/20 | 0.43 |
| ▸ | CYP4Z1 | Q86W10 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27787872 | 0.86 | KCNMA1 (0.53) | ATMKCNMA1SLC9A1ALDH1A1LMNA | |
| SCHEMBL3878065 | 0.81 | KCNMA1 (0.80) | ATMKCNMA1SLC9A1ALDH1A1LMNA | |
| SCHEMBL5416738 | 0.80 | KCNMA1 (0.54) | ATMKCNMA1SLC9A1CYP4Z1 | |
| SCHEMBL27787690 | 0.79 | KCNMA1 (0.60) | ATMKCNMA1SLC9A1GRM2BRD4 | |
| SCHEMBL20815428 | 0.77 | KCNMA1 (0.64) | ATMKCNMA1SLC9A1ALDH1A1LMNA | |
| SCHEMBL16146902 | 0.76 | KCNMA1 (0.52) | ATMKCNMA1SLC9A1CYP4Z1 | |
| SCHEMBL201764 | 0.73 | ALOX5 (0.61) | — | |
| SCHEMBL1834794 | 0.73 | SLC9A1 (1.00) | SLC9A1LMNATSHRKMT2AGRM2 | |
| SCHEMBL14953573 | 0.72 | SLC9A1 (0.58) | ATMKCNMA1SLC9A1ALDH1A1LMNA | |
| SCHEMBL8045378 | 0.72 | KMT2A (0.70) | ATMKCNMA1SLC9A1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101809064-B | Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2012-06-13 | — | — | CN | disclosed |
| CN-101809064-A | Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2010-08-18 | — | — | CN | disclosed |