Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KCNMA1 | Q12791 | 1/20 | 0.60 |
| ▸ | SLC9A1 | P19634 | 8/20 | 0.52 |
| ▸ | BRD4 | O60885 | 1/20 | 0.50 |
| ▸ | ATM | Q13315 | 1/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.48 |
| ▸ | GRM2 | Q14416 | 2/20 | 0.48 |
| ▸ | PLA2G4A | P47712 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29839046 | 0.80 | KCNMA1 (0.69) | KCNMA1SLC9A1BRD4ATMTDP1 | |
| SCHEMBL27787691 | 0.79 | ATM (0.64) | KCNMA1SLC9A1BRD4ATMTDP1 | |
| SCHEMBL27787872 | 0.79 | KCNMA1 (0.53) | KCNMA1SLC9A1BRD4ATMTDP1 | |
| SCHEMBL28967756 | 0.77 | SLC9A1 (0.65) | SLC9A1TDP1GRM2PLA2G4A | |
| SCHEMBL30179307 | 0.77 | SLC9A1 (0.65) | SLC9A1TDP1GRM2PLA2G4A | |
| SCHEMBL22582701 | 0.72 | SLC9A1 (0.56) | SLC9A1TDP1GRM2PLA2G4A | |
| SCHEMBL20815428 | 0.71 | KCNMA1 (0.64) | KCNMA1SLC9A1BRD4ATMTDP1 | |
| SCHEMBL10884371 | 0.71 | KCNMA1 (0.47) | KCNMA1SLC9A1PLA2G4A | |
| SCHEMBL20246151 | 0.71 | SLC9A1 (0.54) | KCNMA1SLC9A1BRD4ATMTDP1 | |
| SCHEMBL1024663 | 0.71 | HPGD (0.57) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101809064-B | Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2012-06-13 | — | — | CN | disclosed |
| CN-101809064-A | Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2010-08-18 | — | — | CN | disclosed |