Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 1.00 |
| ▸ | LMNA | P02545 | 3/20 | 1.00 |
| ▸ | NFKB1 | P19838 | 1/20 | 1.00 |
| ▸ | PMP22 | Q01453 | 1/20 | 1.00 |
| ▸ | SLC22A6 | Q4U2R8 | 2/20 | 0.77 |
| ▸ | GPR84 | Q9NQS5 | 8/20 | 0.75 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.75 |
| ▸ | FFAR4 | Q5NUL3 | 2/20 | 0.75 |
| ▸ | PPARG | P37231 | 7/20 | 0.71 |
| ▸ | PPARD | Q03181 | 7/20 | 0.71 |
| ▸ | PPARA | Q07869 | 7/20 | 0.71 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.71 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.71 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.71 |
| ▸ | TLR2 | O60603 | 2/20 | 0.71 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.71 |
| ▸ | MEN1 | O00255 | 2/20 | 0.71 |
| ▸ | FABP4 | P15090 | 2/20 | 0.71 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.71 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.71 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL35775 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| Adipic Acid SCHEMBL5475921 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| SCHEMBL1674812 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| SCHEMBL596235 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| SCHEMBL166746 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| Azelaic Acid SCHEMBL2724296 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| SCHEMBL25186232 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| Sebacic Acid SCHEMBL301600 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| SCHEMBL21065467 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 | |
| Sebacic Acid SCHEMBL20500595 | 1.00 | TSHR (1.00) | TSHRLMNANFKB1PMP22SLC22A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 162 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3134481-A1 | THERMAL ENERGY STORAGE AND TEMPERATURE STABILIZATION PHASE CHANGE MATERIALS COMPRISING ALKANOLAMIDES AND DIESTERS AND METHODS FOR MAKING AND USING THEM | Entropy Solutions, Inc. (US) | 2017-03-01 | — | — | EP | claimed |
| US-20170044414-A1 | THERMAL ENERGY STORAGE AND TEMPERATURE STABILIZATION PHASE CHANGE MATERIALS COMPRISING ALKANOLAMIDES AND DIESTERS AND METHODS FOR MAKING AND USING THEM | ENTROPY SOLUTIONS LLC | 2017-02-16 | — | — | US | claimed |
| WO-2015164654-A1 | THERMAL ENERGY STORAGE AND TEMPERATURE STABILIZATION PHASE CHANGE MATERIALS COMPRISING ALKANOLAMIDES AND DIESTERS AND METHODS FOR MAKING AND USING THEM | ENTROPY SOLUTIONS INC. (US) | 2015-10-29 | — | — | WO | claimed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4703345-A1 | A PROCESS FOR THE SELECTIVE DEOXYGENATION OF CARBOXYLIC ACIDS OR DERIVATIVES THEREOF | Universität Konstanz (DE) | 2026-03-04 | — | — | EP | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| WO-2015164654-A1 | THERMAL ENERGY STORAGE AND TEMPERATURE STABILIZATION PHASE CHANGE MATERIALS COMPRISING ALKANOLAMIDES AND DIESTERS AND METHODS FOR MAKING AND USING THEM | ENTROPY SOLUTIONS INC. (US) | 2015-10-29 | — | — | WO | disclosed |
| US-20150191607-A1 | Anti-fouling Paints and Coatings | REACTIVE SURFACES, LTD (US) | 2015-07-09 | — | — | US | disclosed |
| WO-2015017866-A1 | PROCESSES AND HOST CELLS FOR GENOME, PATHWAY, AND BIOMOLECULAR ENGINEERING | ENEVOLV, INC. (US) | 2015-02-05 | — | — | WO | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| US-8298747-B2 | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20100210745-A1 | Molecular Healing of Polymeric Materials, Coatings, Plastics, Elastomers, Composites, Laminates, Adhesives, and Sealants by Active Enzymes | REACTIVE SURFACES, LTD. (US) | 2010-08-19 | — | — | US | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| EP-2133743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-4863825-A | Low temperature electrophotographic toner composition comprising nonlinear polyester resin | TOYO INK MANUFACTURING CO., LTD. (JP) | 1989-09-05 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | TSHR 3312/4885LMNA 1962/4885NFKB1 3545/4885 |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | TSHR 3214/4885LMNA 1788/4885NFKB1 3689/4885 |
| US-20170044414-A1 | THERMAL ENERGY STORAGE AND TEMPERATURE STABILIZATION PHASE CHANGE MATERIALS COMPRISING ALKANOLAMIDES AND DIESTERS AND METHODS FOR MAKING AND USING THEM | PFAS, ALKBH2, ALKBH5 | TSHR 3634/4885LMNA 211/4885NFKB1 4342/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | TSHR 3322/4885LMNA 667/4885NFKB1 3094/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | TSHR 2884/4885LMNA 1341/4885NFKB1 2375/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | TSHR 3402/4885LMNA 2609/4885NFKB1 3936/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.