SCHEMBL278588

SCHEMBL278588

Cc1c(Cc2ccccc2)cc(O)c(O)c1O

nearest known ligand 0.62

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
BCL2 P10415 1/20 0.62
BCL2L1 Q07817 1/20 0.62
LDHA P00338 1/20 0.50
LDHB P07195 1/20 0.50
ALOX5 P09917 1/20 0.50
MEN1 O00255 1/20 0.47
CYP3A4 P08684 1/20 0.47
HPGD P15428 1/20 0.47
ALOX15 P16050 1/20 0.47
KMT2A Q03164 1/20 0.47
HIF1A Q16665 1/20 0.47
HSD17B10 Q99714 1/20 0.47
CNR2 P34972 1/20 0.47
GPR55 Q9Y2T6 1/20 0.47
IDH1 O75874 1/20 0.44
PTPN1 P18031 2/20 0.44
PTPN2 P17706 1/20 0.44
PTPN6 P29350 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11787363 0.89 BCL2 (0.62) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL5013940 0.82 PTPN1 (0.50) MEN1KMT2AHIF1AHSD17B10PTPN1
SCHEMBL10600382 0.82 BCL2 (0.53) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL27520897 0.78 BCL2 (0.52) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL2514742 0.78 BCL2 (0.82) BCL2BCL2L1ALOX5MEN1CYP3A4
SCHEMBL18604567 0.78 BCL2 (1.00) BCL2BCL2L1ALOX5MEN1CYP3A4
SCHEMBL11785185 0.77 BCL2 (0.56) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL22054607 0.77 BCL2 (0.73) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL27892158 0.76 BCL2 (0.60) BCL2BCL2L1LDHALDHBALOX5
SCHEMBL16900574 0.76 BCL2 (0.64) BCL2BCL2L1LDHALDHBALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8198006-B2 Process for producing semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2012-06-12 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-20100183985-A1 PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-07-22 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT RARA, AASDHPPT, GABRP BCL2 2744/4885BCL2L1 4263/4885LDHA 3603/4885
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CD79B, BRIX1, SMARCB1 BCL2 4701/4885BCL2L1 4643/4885LDHA 2677/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.