SCHEMBL2798558

SCHEMBL2798558

Cc1c(CO)c(C)c(CO)c(O)c1CO

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.38
ALDH1A1 P00352 1/20 0.38
HPGD P15428 1/20 0.38
HSD17B10 Q99714 1/20 0.38
DRD4 P21917 1/20 0.38
GABRA1 P14867 1/20 0.33
GABRG2 P18507 1/20 0.33
GABRB3 P28472 1/20 0.33
ERBB2 P04626 1/20 0.33
PIM1 P11309 1/20 0.33
HKDC1 Q2TB90 1/20 0.33
LMNA P02545 1/20 0.30
SHBG P04278 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8351615 0.88 KDM4E (0.35) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL16597206 0.88 ERBB2 (0.39) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL5516684 0.88 KDM4E (0.38) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL4175469 0.87 KDM4E (0.33) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL11056777 0.80 HPGD (0.35) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL217886 0.80 KDM4E (0.31) KDM4EALDH1A1HPGDHSD17B10GABRA1
SCHEMBL12766214 0.79 KDM4E (0.33) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL217789 0.79 KDM4E (0.33) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL13025134 0.79 KDM4E (0.37) KDM4EALDH1A1HPGDHSD17B10DRD4
SCHEMBL10130972 0.78 CA2 (0.42) KDM4EALDH1A1HPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025095045-A1 TRANSPARENT RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2025-05-08 WO disclosed
WO-2025095046-A1 RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND LIGHT EMITTING ELEMENT MOUNTED SUBSTRATE 太陽ホールディングス株式会社 2025-05-08 WO disclosed
US-12044968-B2 Protective film-forming composition having acetal structure and amide structure NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12044968-B2 Protective film-forming composition having acetal structure and amide structure NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12025916-B2 Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added NISSAN CHEMICAL CORPORATION (JP) 2024-07-02 US disclosed
US-12025916-B2 Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added NISSAN CHEMICAL CORPORATION (JP) 2024-07-02 US disclosed
US-11815815-B2 Composition for forming silicon-containing resist underlayer film removable by wet process NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-11-14 US disclosed
US-20230359123-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-09 US disclosed
US-20230359123-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-09 US disclosed
US-20230350299-A1 STEP SUBSTRATE COATING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-02 US disclosed
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-12-16 US disclosed
US-20100233619-A1 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-09-16 US disclosed
EP-2228400-A1 Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation Shin-Etsu Chemical Co., Ltd. (JP) 2010-09-15 EP disclosed
US-7749682-B2 Alkali-developable black photosensitive resin composition for forming light-shielding barrier wall NIPPON SHEET GLASS CO., LTD. (JP) 2010-07-06 US disclosed
US-20090111048-A1 ALKALI-DEVELOPABLE BLACK PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING LIGHT-SHIELDING BARRIER WALL TAIYO INK MFG.CO., LTD. (JP) 2009-04-30 US disclosed
US-7476476-B2 Photosensitive resin composition, electronic component using the same, and display unit using the same TORAY INDUSTRIES, INC. (JP) 2009-01-13 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-6773855-B1 PRINTED CIRCUIT BOARD HAVING A SOLDER RESIST FILM FORMED FROM THE CURED FILM TAIYO INK MANUFACTURING CO., LTD. (JP) 2004-08-10 US disclosed
US-4436804-A Light-sensitive polymeric diazonium condensates and reproduction compositions and materials therewith AMERICAN HOECHST CORPORATION (US) 1984-03-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION ICAM1, ESD, CAD KDM4E 117/4885ALDH1A1 599/4885HPGD 3057/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.