Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GLA | P06280 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | LTA4H | P09960 | 1/20 | 0.33 |
| ▸ | PSIP1 | O75475 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.31 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.31 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.31 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.31 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.31 |
| ▸ | RELA | Q04206 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4392736 | 0.89 | LTA4H (0.37) | GLAL3MBTL1LTA4HPSIP1TP53 | |
| SCHEMBL733329 | 0.81 | CA4 (0.41) | LTA4HCA4POLBLMNATSHR | |
| SCHEMBL6151730 | 0.75 | LTA4H (0.37) | GLAL3MBTL1LTA4HTP53TSHR | |
| SCHEMBL19713205 | 0.68 | ACHE (0.38) | — | |
| SCHEMBL6151529 | 0.66 | CA4 (0.41) | LTA4HCA4POLBLMNATSHR | |
| SCHEMBL10879171 | 0.62 | LTA4H (0.43) | L3MBTL1LTA4HTP53CA4LMNA | |
| Toluene SCHEMBL28958652 | 0.61 | LMNA (0.48) | L3MBTL1LTA4HTP53POLBLMNA | |
| Biphenyl SCHEMBL10876569 | 0.61 | ALDH1A1 (0.53) | L3MBTL1LTA4HTP53CA4CHRNB2 | |
| SCHEMBL149837 | 0.61 | TP53 (0.41) | PSIP1TP53LMNATSHRCHRNB2 | |
| SCHEMBL733807 | 0.61 | LTA4H (0.45) | L3MBTL1LTA4HCA4TSHRCHRNB2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108026652-B | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2019-10-25 | — | — | CN | disclosed |
| CN-110099518-A | The preparation method of resin base material, the preparation method of printing distributing board, the preparation method of the preparation method of printed circuit board and e-machine | JX日矿日石金属株式会社 | 2019-08-06 | — | — | CN | disclosed |
| CN-104685980-B | The manufacturing method and base substrate of multilayer printed wiring board | JX日矿日石金属株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108696988-A | The manufacturing method of attached release layer copper foil, laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-108696998-A | The copper foil of attached release layer, the manufacturing method of laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-108401362-A | The manufacturing method of metal foil, laminate, printing distributing board, semiconductor packages, e-machine and printing distributing board | ＪＸ金属株式会社 | 2018-08-14 | — | — | CN | disclosed |
| CN-108026652-A | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-05-11 | — | — | CN | disclosed |
| CN-107921749-A | Surface-treated metal foil, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107710890-A | Method for manufacturing printed wiring board, surface-treated copper foil, laminate, printed wiring board, semiconductor package, and electronic device | ＪＸ金属株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107529282-A | The copper foil of attached release layer, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2017-12-29 | — | — | CN | disclosed |
| CN-104943255-A | Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, semiconductor package, and method for manufacturing printed wiring board | JX NIPPON MINING & METALS CORP | 2015-09-30 | — | — | CN | disclosed |
| CN-104685980-A | Production method for multilayer printed wiring board, and base material | JX NIPPON MINING & METALS CORP | 2015-06-03 | — | — | CN | disclosed |
| CN-104661810-A | Carrier-attached metal foil, laminate comprising resin plate-like carrier and metal foil, and use thereof | JX NIPPON MINING & AMP | 2015-05-27 | — | — | CN | disclosed |